Patents by Inventor William A. Beck
William A. Beck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12243682Abstract: Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.Type: GrantFiled: March 25, 2021Date of Patent: March 4, 2025Assignee: Massachusetts Institute of TechnologyInventors: Brian Labombard, William Beck, Theodore Mouratidis
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Patent number: 12208260Abstract: Systems, methods, and devices to facilitate insertion of certain leads with electrode(s) into patients are described. Leads can be implanted to work in conjunction with a cardiac pacemaker or cardiac defibrillator. A lead for cardiac therapy may be inserted into an intercostal space associated with the cardiac notch of a patient. Devices for delivery may include, for example, a delivery system coupled with an electrical lead and having a handle, a component advancer and insertion tips. The handle is configured to be actuated by an operator and the component advancer is configured to advance an electrical lead into the patient. The insertion tips can be configured to close around the electrical lead within the component advancer, to push through biological tissue, and to open to enable the lead to advance into the patient. The electrical lead can also be maintained in a particular orientation during the advancement into the patient.Type: GrantFiled: May 29, 2020Date of Patent: January 28, 2025Assignee: Kurin, Inc.Inventors: Rick Sanghera, Matthew Rollins, John Beck, William Born, Shahn Sage, Alan Marcovecchio
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Publication number: 20250016958Abstract: A high capacity current lead (10) comprises components that are electrically coupled using indium joints. The current lead includes a heat exchanger having a portion at room temperature (100) and a portion (200) within a vacuum cryostat. The room-temperature portion is temperature controlled against both overheating and over-cooling. The cryogenic portion (200) of the heat exchanger is electrically coupled to a coolant boiling chamber (300) using indium joints. The boiling chamber (300) has a lid and a base that may be electrically coupled using indium joints, or they may be brazed. The boiling chamber (300) is surrounded by a vacuum lid that may be electrically coupled to the base using indium joints, or brazed. The base is electrically coupled to a superconductor module (400) having high-temperature superconductor (HTS) tapes for conveying current to a device, such as a superconducting electromagnet.Type: ApplicationFiled: November 10, 2022Publication date: January 9, 2025Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Vincent FRY, Alexander ZHUKOVSKY, Philip MICHAEL, Ernest IHLOFF, Michael WOLF, William BECK
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Publication number: 20240420875Abstract: Described are concepts, systems, structures and techniques for metal filling an open channel (12) in a baseplate (19). In embodiments, metal filling of an open baseplate channel is achieved using vacuum pressure impregnation (VPI). In embodiments, a compression plate (14a) is disposed over an open baseplate channel (12) to be filled with a molten metal. In embodiments, gaskets (97) are disposed between the compression plate (14a) and a surface of the baseplate (10) proximate the baseplate channel (12). In embodiments, a channel cap (26) is disposed over the open channel. In embodiments, the channel cap (26) has a solder flow channel (29, 32) provided in a surface thereof. In the embodiments, the solder flow channel (29, 32) has a meandering shape. In embodiments, a solder flow channel (29, 32?) is provided in the compression plate (14a) and/or the baseplate (10).Type: ApplicationFiled: November 15, 2022Publication date: December 19, 2024Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Amanda HUBBARD, Brian LABOMBARD, Richard MURRAY, James IRBY, Rui VIEIRA, William BECK, Thomas TOLAND, Vincent FRY, Shane SCHWEIGER, Amelia WATTERSON, Sarah CHAMBERLAIN, Jose ESTRADA, Theodore MOURATIDIS, Kenneth STEVENS
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Publication number: 20240290520Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.Type: ApplicationFiled: February 20, 2024Publication date: August 29, 2024Applicant: Massachusetts Institute of TechnologyInventors: Amanda HUBBARD, James IRBY, Rui VIEIRA, William BECK, Richard MURRAY, Andrew PFEIFFER, Thomas TOLAND, William BURKE
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Publication number: 20240203628Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: September 28, 2023Publication date: June 20, 2024Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11948704Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.Type: GrantFiled: November 12, 2020Date of Patent: April 2, 2024Assignee: Massachusetts Institute of TechnologyInventors: Amanda Hubbard, James Irby, Rui Vieira, William Beck, Richard Murray, Andrew Pfeiffer, Thomas Toland, William Burke
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Patent number: 11821066Abstract: Systems and methods of non-contact tensioning of a metal strip during metal processing include passing the metal strip adjacent a magnetic rotor. The magnetic rotor is spaced apart from the metal strip by a first distance. The systems and methods also include tensioning the metal strip through the magnetic rotor by rotating the magnetic rotor. Rotating the magnetic rotor induces a magnetic field into the metal strip such that the metal strip is tensioned in an upstream direction or a downstream direction. In other aspects, rotating the magnetic rotor induces a magnetic field into the metal strip such that a force normal to a surface of the metal strip is applied to the metal strip.Type: GrantFiled: June 21, 2021Date of Patent: November 21, 2023Assignee: Novelis Inc.Inventors: Antoine Jean Willy Pralong, David Anthony Gaensbauer, Rodger Brown, William Beck, Andrew James Hobbis
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Publication number: 20230361549Abstract: Described are cable joints and related structures and techniques for coupling high temperature superconducting (HTS) cables. A cable joint includes a conductive member having a length which defines the length of the joint and having first and second mounting regions shaped to accept first and second HTS cable with an interface layer comprised of a malleable metal disposed between a surfaces of the first and second mounting regions and surfaces of the first and second HTS cables.Type: ApplicationFiled: December 2, 2020Publication date: November 9, 2023Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Zachary HARTWIG, Philip MICHAEL, Brandon N. SORBOM, James IRBY, Rui VIEIRA, William BECK, Erica SALAZAR, Vincent FRY
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Patent number: 11810712Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 30, 2022Date of Patent: November 7, 2023Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20230207171Abstract: Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.Type: ApplicationFiled: March 25, 2021Publication date: June 29, 2023Applicant: Massachusetts Institute of TechnologyInventors: Brian LABOMBARD, William BECK, Theodore MOURATIDIS
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Publication number: 20230073419Abstract: Schemes are described for conductor and coolant placement in stacked-plate superconducting magnets, including arranging coolant channels and conducting channels within the plates on opposing faces. If the two types of channels are aligned with one another across the plate stacks, the plates may be stacked such that the cooling channel in one plate is adjacent to the conducting channel of the neighboring plate. By stacking a number of these plates, therefore, cooling may be supplied to each conducting channel through the cooling channels of each neighboring plate. Moreover, by aligning the two types of channels, the stacks of plates may have improved mechanical strength because mechanical load paths through the entire stack that do not pass through any of the channels may be created. This arrangement of channels may produce a very strong stack of plates that can withstand high Lorentz loads.Type: ApplicationFiled: March 25, 2021Publication date: March 9, 2023Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian LABOMBARD, Robert MUMGAARD, William BECK, Jeffrey DOODY
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Patent number: 11499213Abstract: Systems and methods of threading a metal substrate on a rolling mill include receiving a coil of the metal substrate. The method also includes uncoiling the metal substrate from the coil while the coil and guiding the metal substrate to a work stand of the rolling mill with a threading system.Type: GrantFiled: June 21, 2019Date of Patent: November 15, 2022Assignee: Novelis Inc.Inventors: Andrew James Hobbis, Antoine Jean Willy Pralong, Stephen Lee Mick, Rodger Brown, Mark Finn, Peter Knelsen, Terry Lee, Hansjuerg Alder, William Beck, Roberto Quintal, Natasha Iyer, Jeffrey Edward Geho
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Publication number: 20220349038Abstract: A rapid quenching line can be suitable for use with hot coil at, or above the metal strip's recrystallization point. Hot coil can be uncoiled by a low tension uncoiler using a non-contacting hold-down device. The metal strip coming off the hot coil is rapidly quenched (e.g., at rates of at or above 100° C./s or 200° C./s) through multiple quenching zones. Coolant can be removed, such as with an air knife and/or a wiper (e.g., an ultra-compliant wiper). Steam can be collected from earlier quenching zones and be repurposed to provide humid air to the metal strip, such as at regions where the temperature of the metal strip is at or below the Leidenfrost point. The cooled metal strip can pass through a bridle to increase the tension in the metal strip before the metal strip is optionally lubricated and then recoiled or otherwise further processed.Type: ApplicationFiled: October 13, 2020Publication date: November 3, 2022Applicant: Novelis Inc.Inventors: David Anthony Gaensbauer, William Beck, Frank Su, Samuel Robert Wagstaff, Steven L. Mick, Andrew James Hobbis
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Publication number: 20220336130Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11417464Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 11, 2021Date of Patent: August 16, 2022Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Patent number: 11396925Abstract: A cable assembly may include a cable communicatively coupling a first information handling resource to a second information handling resource and a cable chain for guiding a routing of the cable, the cable chain comprising a plurality of cable chain links. Each cable chain link may include a plurality of coupling features for rotatably coupling, about an axis, such cable chain link to another cable chain link, one or more limiting features for limiting a rotation of such cable chain link to the other cable chain link, and an opening formed in such cable chain link and configured such that the cable chain has a lengthwise opening along one side of the cable chain which forms a channel for receiving the cable.Type: GrantFiled: February 11, 2020Date of Patent: July 26, 2022Assignee: Dell Products L.P.Inventors: Megan Wingfield, Bernard D. Strmiska, Robert B. Curtis, Destin Ray, Matthew Parmlee, Elliot Le, Henry Gomez, William Beck
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Patent number: 11377721Abstract: Systems and methods of threading a metal substrate on a rolling mill include receiving a coil of the metal substrate. The method also includes uncoiling the metal substrate from the coil while the coil and guiding the metal substrate to a work stand of the rolling mill with a threading system.Type: GrantFiled: June 21, 2019Date of Patent: July 5, 2022Assignee: Novelis Inc.Inventors: Andrew James Hobbis, Antoine Jean Willy Pralong, Stephen Lee Mick, Rodger Brown, Mark Finn, Peter Knelsen, Terry Lee, Hansjuerg Alder, William Beck, Roberto Quintal, Natasha Iyer, Jeffrey Edward Geho
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Patent number: 11242586Abstract: Systems and methods of threading a metal substrate on a rolling mill include receiving a coil of the metal substrate. The method also includes uncoiling the metal substrate from the coil while the coil and guiding the metal substrate to a work stand of the rolling mill with a threading system.Type: GrantFiled: June 21, 2019Date of Patent: February 8, 2022Assignee: Novelis Inc.Inventors: Andrew James Hobbis, Antoine Jean Willy Pralong, Stephen Lee Mick, Rodger Brown, Mark Finn, Peter Knelsen, Terry Lee, Hansjuerg Alder, William Beck, Roberto Quintal, Natasha Iyer, Jeffrey Edward Geho
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Publication number: 20220013256Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.Type: ApplicationFiled: November 12, 2020Publication date: January 13, 2022Inventors: Amanda HUBBARD, James IRBY, Rui VIEIRA, William BECK, Richard MURRAY, Andrew PFEIFFER, Thomas TOLAND, William BURKE