Patents by Inventor William A. Bold

William A. Bold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer interconnect circuitry using photoimageable dielectric
    Patent number: 4566186
    Abstract: A method of fabricating multilayer printed circuit boards using polymer thick film technology is disclosed which utilizes photoimageable dielectric material between conductive polymer thick film layers and which is capable of producing extremely small and uniformly-sized vias.
    Type: Grant
    Filed: June 29, 1984
    Date of Patent: January 28, 1986
    Assignee: Tektronix, Inc.
    Inventors: Charles E. Bauer, William A. Bold