Abstract: Systems and methods usable in delivering an anchoring or docking device to a native valve of a patient's heart. A distal region of a delivery catheter can be positioned in an atrium of the heart and a. distal tip can be positioned at or near a commissure of the native valve using a steerable sheath. The one or more bends can be generated and/or adjusted in a distal portion of the steerable sheath to manipulate the position of the distal tip of the delivery catheter.

Abstract: Described are various embodiments of space-compressing methods, materials, devices, and systems, and imaging or optical devices and systems using same. In one embodiment, an optical system comprises an optical convergence element having a defined optical path convergence distance and disposed so to produce converging optical rays along an optical convergence path to converge at said distance; an optical space-compression medium disposed along the optical convergence path to intersect the converging optical rays to compress a resulting optical convergence distance by imparting an inward transverse translation of the converging optical rays while substantially maintaining respective incident convergence angles upon output.

Abstract: A system for treating a diseased native valve in a patient includes a valve prosthesis and a delivery device. The prosthesis includes an anchor and a frame. The delivery device includes an outer sheath, an inner shaft, an anchor guide, and a tether. The anchor is shaped to encircle chordae or leaflets of a native valve. The frame is configured to sit within the anchor. The inner shaft is positioned within the outer sheath and translatable and rotatable relative to the outer sheath. The anchor guide is attached to a distal end of the inner shaft and has a curved distal section. The tether is configured to detachably couple to the anchor and to longitudinally translate the anchor within the inner shaft and anchor guide. The anchor is configured to be actuated from a delivery configuration to the deployed configuration when the anchor is translated out of the anchor guide.

Abstract: A method for treating a diseased native valve in a patient includes tracking a positioning tool in a first configuration and a valve delivery device over a tether into a heart where the tether is connected to a spiral anchor in the heart; activating the positioning tool from the first configuration to a second configuration that is stiffer than the first configuration; adjusting, with the positioning tool, a position of the spiral anchor relative to a valve positioned within the delivery device; and deploying a valve from the delivery device to an expanded position within the spiral anchor.

Abstract: A system for treating a diseased native valve in a patient includes a valve prosthesis and a delivery device. The prosthesis includes an anchor and a frame. The delivery device includes an outer sheath, an inner shaft, an anchor guide, and a tether. The anchor is shaped to encircle chordae or leaflets of a native valve. The frame is configured to sit within the anchor. The inner shaft is positioned within the outer sheath and translatable and rotatable relative to the outer sheath. The anchor guide is attached to a distal end of the inner shaft and has a curved distal section. The tether is configured to detachably couple to the anchor and to longitudinally translate the anchor within the inner shaft and anchor guide. The anchor is configured to be actuated from a delivery configuration to the deployed configuration when the anchor is translated out of the anchor guide.

Abstract: A baffle is provided herein. The baffle includes a cylindrical baffle section. The cylindrical baffle section includes one or more holes. The baffle also includes a split line retaining section. The split line retaining section includes one or more mounting bosses. Each of the one or more mounting bosses receives one or more mounting bolts.

Abstract: Methods and associated apparatuses are described herein that provide a tile alternative material. The tile alternative material may be manufactured by providing a substrate that defines a first surface, and a second surface opposite the first surface. The second surface is configured to be secure, via an adhesive or otherwise, to a support surface. The method further includes coating an exterior layer on the first surface of the substrate, and forming a pattern element in the first surface of the substrate. Forming the pattern element includes removing material from the substrate and the coated exterior layer of the first surface to form one or more recessed portions.

Abstract: A baffle is provided herein. The baffle includes a cylindrical baffle section. The cylindrical baffle section includes one or more holes. The baffle also includes a split line retaining section. The split line retaining section includes one or more mounting bosses. Each of the one or more mounting bosses receives one or more mounting bolts.

Abstract: Described are various embodiments of space-compressing methods, materials, devices, and systems, and imaging or optical devices and systems using same. In one embodiment, an optical system comprises an optical convergence element having a defined optical path convergence distance and disposed so to produce converging optical rays along an optical convergence path to converge at said distance; an optical space-compression medium disposed along the optical convergence path to intersect the converging optical rays to compress a resulting optical convergence distance by imparting an inward transverse translation of the converging optical rays while substantially maintaining respective incident convergence angles upon output.

Abstract: This disclosure describes methods, devices, systems, and procedures in a computing system for capturing a configuration state of an operating system executing on a central processing unit (CPU), and offloading tasks for managing malware and vulnerable software, based on the configuration state, to a resource management unit, such as a system-on-chip (SoC). The resource management unit identifies a status of a process as malware or vulnerable software, based on its fingerprint, and acts to protect the computing system from unwanted effects.

Abstract: A motor drive circuit for driving an electric motor includes a plurality of driver circuits, each one of the plurality of driver circuit comprising a high side transistor coupled to a low side transistor in a half bridge arrangement, wherein each one of the high side transistors and each one of the low side transistors has a respective control node and respective first and second current passing nodes, wherein the second current passing node of each of the high side transistors is coupled to the first current passing node of a respective one of the low side transistors at a respective junction node, wherein each one of the plurality of driver circuits is operable to drive a respective current out of a respective junction node into a respective winding of the electric motor. The motor drive circuit further includes a capacitor coupled to the first current passing node of each one of the high side transistors, the capacitor operable to hold a capacitor voltage.

Abstract: A system for treating a diseased native valve in a patient includes a valve prosthesis and a delivery device. The prosthesis includes an anchor and a frame. The delivery device includes an outer sheath, an inner shaft, an anchor guide, and a tether. The anchor is shaped to encircle chordae or leaflets of a native valve. The frame is configured to sit within the anchor. The inner shaft is positioned within the outer sheath and translatable and rotatable relative to the outer sheath. The anchor guide is attached to a distal end of the inner shaft and has a curved distal section. The tether is configured to detachably couple to the anchor and to longitudinally translate the anchor within the inner shaft and anchor guide. The anchor is configured to be actuated from a delivery configuration to the deployed configuration when the anchor is translated out of the anchor guide.

Abstract: A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may be formed over the carrier. A first portion of a conductive interconnect may be formed over the build-up interconnect structure in a periphery of the semiconductor die mounting site. An etch stop layer and a second portion of the conductive interconnect may be formed over the first portion of the conductive interconnect. A semiconductor die may be mounted to the build-up interconnect at the semiconductor die mounting site. The conductive interconnect and the semiconductor die may be encapsulated with a mold compound. A first end of the conductive interconnect on the second portion of the conductive interconnect may be exposed. The carrier may be removed to expose the build-up interconnect structure. The first portion of the conductive interconnect may be etched to expose the etch stop layer.

Abstract: A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the semiconductor substrate to form a pool of etching solution on the layer of material, wherein a footprint of the pool of etching solution is less than a footprint of the semiconductor substrate. The pool of etching solution and the semiconductor substrate can be moved with respect to each other. A pool boundary of the pool of etching solution can be defined on the semiconductor substrate with at least one air-knife such that the pool of etching solution etches the layer of material over the semiconductor substrate within the footprint of the pool of etching solution. The etching solution and at least a portion of the layer of material etched by the etching solution can be removed with the at least one air-knife.

Abstract: A motor drive circuit for driving an electric motor includes a plurality of driver circuits, each one of the plurality of driver circuit comprising a high side transistor coupled to a low side transistor in a half bridge arrangement, wherein each one of the high side transistors and each one of the low side transistors has a respective control node and respective first and second current passing nodes, wherein the second current passing node of each of the high side transistors is coupled to the first current passing node of a respective one of the low side transistors at a respective junction node, wherein each one of the plurality of driver circuits is operable to drive a respective current out of a respective junction node into a respective winding of the electric motor. The motor drive circuit further includes a capacitor coupled to the first current passing node of each one of the high side transistors, the capacitor operable to hold a capacitor voltage.

Abstract: Methods and associated apparatuses are described herein that provide a tile alternative material. The tile alternative material may be manufactured by providing a substrate that defines a first surface, and a second surface opposite the first surface. The second surface is configured to be secure, via an adhesive or otherwise, to a support surface. The method further includes coating an exterior layer on the first surface of the substrate, and forming a pattern element in the first surface of the substrate. Forming the pattern element includes removing material from the substrate and the coated exterior layer of the first surface to form one or more recessed portions.

Abstract: A semiconductor device and method of making the semiconductor device is described. A semiconductor die can be provided. A polymer layer can be formed over the semiconductor die. A via can be formed in the polymer layer. The polymer layer can be cross-linked in a first process, after forming the via, by exposing the polymer layer to ultraviolet (UV) radiation to form a sidewall of the via with via sidewall slope greater than or equal to 45 degrees and to further form a cross-linked via sidewall surface. The polymer layer can be thermally cured in a second process after the first process, wherein a maximum ramp-up rate from room temperature to a peak temperature of the second process is greater than 10 degrees Celsius per minute.

Abstract: A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may be formed over the carrier. A first portion of a conductive interconnect may be formed over the build-up interconnect structure in a periphery of the semiconductor die mounting site. An etch stop layer and a second portion of the conductive interconnect may be formed over the first portion of the conductive interconnect. A semiconductor die may be mounted to the build-up interconnect at the semiconductor die mounting site. The conductive interconnect and the semiconductor die may be encapsulated with a mold compound. A first end of the conductive interconnect on the second portion of the conductive interconnect may be exposed. The carrier may be removed to expose the build-up interconnect structure. The first portion of the conductive interconnect may be etched to expose the etch stop layer.