Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.

Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.

Abstract: Anodized aluminum alloys that are resistant to corrosion are described. According to some embodiments, the anodized aluminum alloys include very small amounts, even trace levels, of corrosion resistant elements with higher Gibbs free energies for oxide formation than aluminum. If the aluminum alloy includes high levels of zinc, the corrosion resistant elements can also have higher Gibbs free energies for oxide formation than zinc. The corrosion resistant elements can accumulate at an interface region of the substrate near the anodic film during the anodizing process, thereby significantly changing the alloy composition in this interface region providing surprising high resistance to certain forms of corrosion. The type and amount of corrosion resistant elements can depend on particular application requirements. In some cases, the anodized aluminum alloys are used as cosmetic appealing housing for consumer electronic products.

Abstract: Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

Abstract: Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.

Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Abstract: This disclosure relates to rapid and repeatable tests that can be used to evaluate the interfacial adhesion of coatings to substrates. In particular embodiments, tests are used to assess the resistance of anodic oxides to delamination from aluminum substrates. The tests can be conducted using standard hardness test equipment such as a Vickers indenter, and yield more controlled, repeatable results than a large sample of life-cycle tests such as rock tumble tests. In particular embodiments, the tests involve forming an array of multiple indentations within the substrate such that stressed regions where the coating will likely delaminate are formed and evaluated.

Abstract: Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

Abstract: Micro additions of certain elements such as zirconium or titanium are added to high strength aluminum alloys to counter discoloring effects of other micro-alloying elements when the high strength alloys are anodized. The other micro-alloying elements are added to increase the adhesion of an anodic film to the aluminum alloy substrate. However, these micro-alloying elements can also cause slight discoloration, such as a yellowing, of the anodic film. Such micro-alloying elements that can cause discoloration can include copper, manganese, iron and silver. The micro additions of additional elements, such as one or more of zirconium, tantalum, molybdenum, hafnium, tungsten, vanadium, niobium and tantalum, can dilute the discoloration of the micro-alloying elements. The resulting anodic films are substantially colorless.

Abstract: A process is disclosed for minimizing the difference in thermal expansivity between a porous anodic oxide coating and its corresponding substrate metal, so as to allow heat treatments or high temperature exposure of the anodic oxide without thermally induced crazing. A second phase of higher thermal expansivity than that of the oxide material is incorporated into the pores of the oxide in sufficient quantity to raise the coating's thermal expansion coefficient. The difference in thermal expansion between the anodic oxide coating and underlying metal substrate is reduced to a level such that thermal exposure is insufficient for any cracking to result. The second phase may be an electrodeposited metal, or an electrophoretically deposited polymer. The second phase may be uniformly deposited to a certain depth, or may be deposited at varying amounts among the pores.

Abstract: Methods of forming anodic oxide coatings on high strength aluminum alloys are described. Methods involve preventing or reducing the formation of interface-weakening species, such as zinc-sulfur compounds, at an interface between an anodic oxide coating and underlying aluminum alloy substrate during anodizing. In some embodiments, a micro-alloying element is added in very small amounts to an aluminum alloy substrate to prevent enrichment of zinc at the anodic oxide and substrate interface, thereby reducing or preventing formation of the zinc-sulfur interface-weakening species. In some embodiments, a sulfur-scavenging species is added to an aluminum alloy substrate to prevent sulfur from a sulfuric acid anodizing bath from binding with zinc and forming the zinc-sulfur interface-weakening species at the anodic oxide and substrate interface. In some embodiments, a micro-alloying element and a sulfur-scavenging species are added to an aluminum alloy substrate.

Abstract: Methods of forming anodic oxide coatings on certain high strength aluminum alloys are described. Methods involve preventing or reducing the formation of interface-weakening species, such as zinc-sulfur compounds, at an interface between an anodic oxide coating and underlying aluminum alloy substrate during anodizing. In some embodiments, a micro-alloying element is added in very small amounts to an aluminum alloy substrate to prevent enrichment of zinc at the anodic oxide and substrate interface, thereby reducing or preventing formation of the zinc-sulfur interface-weakening species. In some embodiments, a sulfur-scavenging species is added to an aluminum alloy substrate to prevent sulfur from a sulfuric acid anodizing bath from binding with zinc and forming the zinc-sulfur interface-weakening species at the anodic oxide and substrate interface. In some embodiments, a micro-alloying element and a sulfur-scavenging species are added to an aluminum alloy substrate.

Abstract: This disclosure relates to rapid and repeatable tests that can be used to evaluate the interfacial adhesion of coatings to substrates. In particular embodiments, tests are used to assess the resistance of anodic oxides to delamination from aluminum substrates. The tests can be conducted using standard hardness test equipment such as a Vickers indenter, and yield more controlled, repeatable results than a large sample of life-cycle tests such as rock tumble tests. In particular embodiments, the tests involve forming an array of multiple indentations within the substrate such that stressed regions where the coating will likely delaminate are formed and evaluated.

Abstract: Anodizing processes for providing durable and defect-free anodic oxide films, well suited for anodizing highly reflective surfaces, are described. In some embodiments, the anodizing electrolyte has a sulfuric acid concentration substantially less than conventional type II anodizing. In some embodiments, the electrolyte includes a mixture of sulfuric acid and one or more organic acids. In further embodiments, sulfuric acid is a relatively minor additive to an organic acid, primarily serving to minimize discoloration. The processes enables porous, optically clear, and colorless anodic films to be grown in a manner similar to conventional Type II sulfuric acid anodizing, but at lower current densities and/or higher temperatures, without compromising film surface hardness. The thickness uniformity of the resulting anodic oxide films can be within 5% between grains of {111}, {110} and {100} surface orientations.

Abstract: Anodic oxide coatings and methods for forming anodic oxide coatings on metal alloy substrates are disclosed. Methods involve post-anodizing processes that improve the appearance of the anodic oxide coating or increase the strength of the underlying metal alloy substrates. In some embodiments, a diffusion promoting process is used to promote diffusion of one or more types of alloying elements enriched at an interface between the anodic oxide coating and the metal alloy substrate away from the interface. The diffusion promoting process can increase an adhesion strength of the anodic oxide film to the metal alloy substrate and reduce an amount of discoloration due to the enriched alloying elements. In some embodiments, a post-anodizing age hardening process is used to increase the strength of the metal alloy substrate and to improve cosmetics of the anodic oxide coatings.

Abstract: Anodic oxide coatings and methods for forming anodic oxide coatings on metal alloy substrates are disclosed. Methods involve post-anodizing processes that improve the appearance of the anodic oxide coating or increase the strength of the underlying metal alloy substrates. In some embodiments, a diffusion promoting process is used to promote diffusion of one or more types of alloying elements enriched at an interface between the anodic oxide coating and the metal alloy substrate away from the interface. The diffusion promoting process can increase an adhesion strength of the anodic oxide film to the metal alloy substrate and reduce an amount of discoloration due to the enriched alloying elements. In some embodiments, a post-anodizing age hardening process is used to increase the strength of the metal alloy substrate and to improve cosmetics of the anodic oxide coatings.