Patents by Inventor William A. Diecks

William A. Diecks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050085577
    Abstract: We disclose a packaging article, defining a package interior and a package exterior, and comprising (i) a first layer, containing an oxygen scavenging polymer the oxygen scavenging polymer comprises (a) an ethylenic backbone or a polyester backbone and (b) at least one cyclic olefinic group; (ii) a second layer, containing a functional barrier polymer; and (iii) a transition metal organic salt in at least one of the first layer or a layer adjacent to the first layer; wherein the second layer is located between the first layer and the package interior. The packaging article can further comprise a functional absorber. Such a packaging article is capable of both scavenging oxygen present in the package interior and inhibiting the migration of off-taste- or off-odor-imparting scavenging byproducts from the first layer to the package interior.
    Type: Application
    Filed: September 13, 2004
    Publication date: April 21, 2005
    Inventors: Ta Yen Ching, James Solis, Ronald Abbott, William Diecks, Darrell Landry
  • Publication number: 20040234791
    Abstract: Multilayer packaging articles contain (i) an oxygen scavenging tie layer which includes polypropylene-graft-acrylic acid (PP-g-AA), polypropylene-graft-maleic anhydride (PP-g-MA), or a mixture thereof; (ii) a second layer; and (iii) a third layer, wherein the oxygen scavenging-tie layer is located between the second layer and the third layer. In addition to the oxygen scavenging function, the oxygen scavenging tie layer functions as a tie layer to inhibit delamination of the second layer from the third layer, or vice versa.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 25, 2004
    Inventors: Ta Yen Ching, James A. Solis, Hu Yang, William A. Diecks