Abstract: This disclosure relates generally to test equipment, apparatuses, and systems for a device under test, such as, but not limited to, a semiconductor device. More specifically, this disclosure relates to test equipment, apparatuses, and systems that are portable for use in atypical testing environments.

Abstract: Processes and devices provide parenteral delivery of therapeutic fluids, in particular high-viscosity therapeutic fluids (e.g., protein therapeutics), by a chemical reaction that generates a gas. A device may include a first actuation chamber containing a first reagent, a second reaction chamber containing a second reagent, and a third therapeutic fluid chamber containing the therapeutic fluid. In a loaded configuration, a plunger separates the first chamber from the second chamber. In a delivery configuration, the plunger allows the first reagent from the first chamber to communicate and react with the second reagent from the second chamber. The generated gas acts upon a plunger to deliver the therapeutic fluid from the third chamber.

Abstract: This disclosure relates generally to test equipment, apparatuses, and systems for a device under test, such as, but not limited to, a semiconductor device. More specifically, this disclosure relates to test equipment, apparatuses, and systems that are portable for use in atypical testing environments.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A test assembly for testing a device under test includes a probe card assembly and a cap secured to the probe card assembly. The probe card assembly includes a probe tile having a plurality of openings. The probe tile includes a plurality of probe wires including a probe needle portion and a probe tip portion. A seal is disposed on a surface of the probe tile and forms an outer perimeter of a pressurized area. The probe tile includes an insulation layer formed within the pressurized area that is configured to separate the probe needle portion from the device under test. The insulation layer includes an aperture through which the probe tip portion extends to contact the device under test. The cap includes a fluid inlet and a fluid return outlet that are in fluid communication with the plurality of openings of the probe tile.

Abstract: A magnet extension, magnetic test assembly, and probe card assembly includes a magnet having a first end and a second end, the first end of the magnet being geometrically configured to provide a selected magnetic field. A resilient member 5 is disposed around the magnet between the first end and the second end. A retaining member is disposed between the first end and the second end. The retaining member surrounds at least a portion of the resilient member.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A test assembly for testing a device under test includes a probe card assembly and a cap secured to the probe card assembly. The probe card assembly includes a probe tile having a plurality of openings. The probe tile includes a plurality of probe wires including a probe needle portion and a probe tip portion. A seal is disposed on a surface of the probe tile and forms an outer perimeter of a pressurized area. The probe tile includes an insulation layer formed within the pressurized area that is configured to separate the probe needle portion from the device under test. The insulation layer includes an aperture through which the probe tip portion extends to contact the device under test. The cap includes a fluid inlet and a fluid return outlet that are in fluid communication with the plurality of openings of the probe tile.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A latch assembly that can lock and unlock a probe core with respect to a circuit board is provided. The latch assembly can engage with the probe core to align the probe core with respect to a circuit board, and press down the probe core against the circuit board by rotating to lock the probe core with the circuit board. An installation tool is provided to grip or release the probe core to/from a latch assembly or a probe core carrier. The installation tool can align with the probe core and/or the latch assembly to lock and unlock the probe core with respect to a circuit board.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

Abstract: A magnet extension, magnetic test assembly, and probe card assembly are disclosed. The magnet extension includes a magnet having a first end and a second end, the first end of the magnet being geometrically configured to provide a selected magnetic field. A resilient member is disposed around the magnet between the first end and the second end. A retaining member is disposed between the first end and the second end. The retaining member surrounds at least a portion of the resilient member.

Abstract: The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a dielectric block mounted in the chassis for retaining the probe, the probe extending on the chassis from a proximal end of the probe to the dielectric block, extending through the dielectric block, and projecting from the dielectric block towards the semiconductor device at a distal end of the probe; and a terminating apparatus, mounted in the chassis, for terminating the proximal end of the probe with a distal end of the signal cable side by side.

Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.

Abstract: A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.