Abstract: Embodiments provide a system where a user can obtain a fractional portion of a blockchain unit. The fractional portion can be obtained as part of a separate arrangement. A computer ledger tracks the fractional interests of multiple users. An aggregator computer communicates with a blockchain computer to record ownership of one or more whole units in a pool. In one embodiment, a concierge system is provided that supports a social equity economy.

Abstract: The present disclosure provides new beverages and methods of making said beverages from hemp juice, coffee fruit, and oranges. The present disclosure also provides new beverages and methods of making said beverages from hemp juice and coffee fruit juice. The disclosure further relates to the production of a non-water-soluble and water-soluble coffee fruit, hemp juice, and orange powders.

Abstract: One embodiment of a modular combination press and puller tool consisting of a tool body (4) comprising a tubular element open at both ends and with a plurality of elongated fins radially displaced on the outer surface of the tubular element, with the long axis of the fins parallel to the longitudinal axis of the tubular element, the fins having a plurality of apertures, and one end of the tubular element at least partially threaded (16) on the internal diameter.

Abstract: One embodiment of a quick release fastener insertable into apertures in platen tables and other surfaces, having at one end a threaded recess (30) to receive studs or bolts, and having a transversely displaceable member (60) to secure the fastener in the aperture. The displaceable member (60) is moved between the inoperative and operative positions by a tool engageable operating rod (80).

Abstract: A method for dehumidification and controlling system pressure in a refrigeration system includes providing a refrigeration system having a compressor, a condenser and an evaporator connected in a closed refrigerant loop. Each of the condenser and evaporator have a plurality of refrigerant circuits. A first heat transfer fluid is flowed over the condenser and a second heat transfer fluid is flowed over the evaporator. At least one of the refrigerant circuits of the condenser is isolated to provide a decreased amount of heat transfer area within the condenser and to increase the refrigerant pressure within the refrigeration system when the refrigerant pressure within the refrigeration system is at or below a predetermined pressure. At least one of the refrigerant circuits of the evaporator is isolated to dehumidify and maintain the temperature of the second heat transfer fluid at or above a predetermined temperature when dehumidification is required.

Abstract: An HVAC system including a compressor, a condenser and an evaporator arrangement connected in a closed refrigerant loop. The evaporator arrangement includes a plurality of refrigerant circuits. The evaporator arrangement also includes at least one distributor configured to distribute and deliver refrigerant to each circuit of the plurality of circuits. The plurality of circuits are arranged into a first and second set of circuits. The evaporator arrangement also includes a valve configured and disposed to isolate the first set of circuits from refrigerant flow from the condenser and provide flow of refrigerant from the compressor in a dehumidification operation of the HVAC system.

Abstract: An HVAC system including a compressor, a condenser and an evaporator connected in a closed refrigerant loop. The evaporator includes a plurality of refrigerant circuits. The evaporator also includes at least one distributor configured to distribute and deliver refrigerant to each circuit of the plurality of circuits. The plurality of circuits are arranged into a first and second set of circuits. The evaporator also includes a valve configured and disposed to isolate the first set of circuits from refrigerant flow from the condenser and provide flow of refrigerant from the compressor in a dehumidification operation of the HVAC system.

Abstract: A method and system for controlling refrigerant pressure in an HVAC system. The method includes providing a compressor, a condenser and an evaporator connected in a closed refrigerant loop. The condenser has a header arrangement capable of distributing refrigerant to a plurality of refrigerant circuits within the condenser. The header arrangement also is capable of selectively isolating at least one of the circuits from refrigerant flow. Refrigerant pressure is sensed at a predetermined location in the refrigeration system. At least one of the circuits is isolated when the refrigerant pressure is less than or equal to a predetermined pressure.

Abstract: A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.

Abstract: An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

Abstract: A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.

Abstract: A semiconductor having an insulating layer, a contact pad, a via, and a sacrificial dielectric cap is provided. The contact pad is embedded in the insulating layer, where the contact pad has a top metal layer of copper. The via creates an opening over the top metal layer. The sacrificial dielectric cap is over at least the top metal layer.

Abstract: An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.

Abstract: An interlevel dielectric layer (ILD) comprises a low-k dielectric layer; and a low-k dielectric film, deposited under compressive stress, atop the dielectric layer. The dielectric layer comprises a low-k material, such as an organosilicon glass (OSG) or a SiCOH material. The dielectric film has a thickness, which is 2%-10% of the thickness of the dielectric layer, has a similar chemical composition to the dielectric layer, but has a different morphology than the dielectric layer. The dielectric film is deposited under compressive stress, in situ, at or near the end of the dielectric layer deposition by altering a process that was used to deposit the low-k dielectric layer.

Abstract: A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting-the bond pads to the Ni/Au pad metallization.

Abstract: Ordinary digital data is reformed and time shifted such that it may be broadcast over a radio link which periodically shifts its frequency. The system of this invention utilizes timing information obtained from a pre-existing frequency-hopping radio link in conjunction with its own buffer and control circuitry to accurately time-position discrete digital data packets within those time bands of the radio transmission wherein the frequency is not changing from one frequency to another. In the drawing, T.sub.H1 is a very short duration pulse which commands the AM frequency--hopping system to shift frequencies. The time period necessary for the frequency hop operation to settle down and attain a stable frequency is represented by the interval between T.sub.H1 and T.sub.1. The actual reception of the uplink message occurs in the interval between T.sub.3 and T.sub.4 ; transmission of the downlink signal from the system occurs in the interval between T.sub.5 and T.sub.6. The interval between T.sub.4 and T.sub.

Abstract: A clamping device for use in an electroplating process is provided having a support with at least one object-engaging portion. At least one element is resiliently attached to the support with each element having an object-engaging portion facing a corresponding object-engaging portion on the support. The element object-engaging portion is resiliently biased toward its corresponding support object-engaging portion. A manually engageable means is attached to each element for separating the element object-engaging portion from its corresponding support object-engaging portion. When more than one element is used, each is individually movable by the manually engageable means. The corresponding object-engaging portions have object-engaging surfaces which are, respectively, in parallel planes. The corresponding object-engaging portions are skewed relative to one another.