Abstract: An electromagnetic interference shielding assembly includes an enclosure and top and bottom covers. The enclosure has interconnected walls arranged in a polygonal configuration to surround an electronic component on a circuit board. Each wall has upper and lower portions extending in opposite directions. The enclosure has upper and lower releasable attachment arrangements respectively formed in the upper and lower portions of the walls and releasably engaged with the top and bottom covers. The upper and lower attachment arrangements are substantially mirror images of one another and define upper and lower annular channels that are open respectively from above and below. Each of the top and bottom covers has a main portion and side portions attached to and extending from the main portion and arranged in a polygonal configuration matching that of the walls of the enclosure.

Abstract: An EMI shielding assembly includes an elongated enclosure made of an electrically conductive material and having a plurality of interconnected walls arranged in a polygonal configuration to surround an electronic component on a circuit board, a plurality of mounting pins attached to lower portions of the walls and extending downwardly from a lower edge thereon for attachment to the circuit board, and plurality of inner and outer tabs formed in upper portions of the walls which extend upwardly from the lower portions thereof. The inner and outer tabs are disposed in spaced apart, alternating and offset relationship with respect to one another along the upper portions of the walls so as to create an annular channel therebetween which extends around the enclosure along the upper portions of the interconnected walls thereof.