Patents by Inventor William A. Moir

William A. Moir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer packaging film and receptacles made therefrom
    Patent number: 5629059
    Abstract: A multi-layer, oriented, heat shrinkable thermoplastic film comprising: (i) a layer composed of a blend of ethylene-vinyl acetate copolymer and a linear ethylene-alpha-olefin copolymer; (ii) a layer composed of (a) a linear ethylene-alpha-olefin copolymer; (b) a material selected from the group consisting of ethylene-vinyl acetate copolymers and ethylene-n-butyl acrylate copolymers; and (c) a narrow molecular weight linear ethylene-alpha-olefin copolymer having a density of less than 0.900 g/cc; (iii) a layer composed of a vinylidene chloride copolymer or an ethylene-vinyl acetate copolymer in which the acetate moieties have been partially or completely hydrolyzed; and (iv) a layer composed of a copolymer of ethylene-vinyl acetate or a blend of ethylene-vinyl acetate copolymer and ethylene-alpha-olefin copolymer.
    Type: Grant
    Filed: December 7, 1993
    Date of Patent: May 13, 1997
    Assignee: W.R. Grace & Co.-Conn.
    Inventors: Bankim B. Desai, David H. Thomson, William A. Moir