Patents by Inventor William A. Reinerth

William A. Reinerth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10875965
    Abstract: This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: December 29, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Ognian Dimov, Raj Sakamuri
  • Patent number: 10793676
    Abstract: A polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of an unsubstituted alkenyl group and an unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: October 6, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 10781341
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted linear alkenyl group and a substituted or unsubstituted linear alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: September 22, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ognian Dimov
  • Publication number: 20200262978
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here] (la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 18, 2017
    Publication date: August 20, 2020
    Inventors: Binod B. De, Sanjay Malik, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini, Raj Sakamuri
  • Publication number: 20200218152
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventors: Binod B. De, Sanjay Malik, Raj Sakamuri, William A. Reinerth, Ognian N. Dimov, Ahmad A. Naiini
  • Patent number: 10696932
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 30, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Patent number: 10604628
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: March 31, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Patent number: 10563014
    Abstract: This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: February 18, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De
  • Publication number: 20190263969
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.
    Type: Application
    Filed: October 26, 2017
    Publication date: August 29, 2019
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190171105
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Application
    Filed: July 11, 2018
    Publication date: June 6, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20190129303
    Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.
    Type: Application
    Filed: October 25, 2017
    Publication date: May 2, 2019
    Inventors: William A. Reinerth, Binod B. De, Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini
  • Publication number: 20190077913
    Abstract: This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.
    Type: Application
    Filed: February 28, 2018
    Publication date: March 14, 2019
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De
  • Publication number: 20190081001
    Abstract: This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.
    Type: Application
    Filed: February 28, 2018
    Publication date: March 14, 2019
    Inventors: Sanjay Malik, William A. Reinerth, Ognian Dimov, Raj Sakamuri
  • Publication number: 20190016999
    Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5-25 percent by weight an alkaline compound; (b) 1-25 percent by weight an alcohol amine compound; (c) 0.1-20 percent by weight a hydroxylammonium compound; (d) 5-95 percent by weight an organic solvent; (e) 0.1-5 percent by weight a corrosion inhibitor compound; and (f) 2-25 percent by weight water.
    Type: Application
    Filed: July 28, 2016
    Publication date: January 17, 2019
    Inventors: Raj Sakamuri, Ognian N. Dimov, Ahmad A. Naiini, Sanjay Malik, Binod B. De, William A. Reinerth
  • Publication number: 20190018321
    Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.
    Type: Application
    Filed: December 20, 2016
    Publication date: January 17, 2019
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Publication number: 20180366419
    Abstract: This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 20, 2018
    Inventors: Sanjay Malik, William A. Reinerth
  • Patent number: 10036952
    Abstract: This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: July 31, 2018
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Sanjay Malik, Raj Sakamuri, Ognian N. Dimov, Binod B. De, William A. Reinerth, Ahmad A. Naiini
  • Patent number: 9777117
    Abstract: This disclosure relates to a process of purifying a polymer. The process includes (a) providing an organic solution containing a polyimide or polyamic ester in at least one polar, aprotic polymerization solvent; (b) adding at least one purification solvent to the organic solution to form a diluted organic solution, the at least one purification solvent is less polar than the at least one polymerization solvent and has a lower water solubility than the at least one polymerization solvent at 25° C.; (c) washing the diluted organic solution with water or an aqueous solution to obtain a washed organic solution; and (d) removing at least a portion of the at least one purification solvent in the washed organic solution to obtain a solution containing a purified polyimide or polyamic ester. This disclosure also relates to a process of preparing a film on a semiconductor substrate, as well as related purified polymer solutions, films, and articles.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 3, 2017
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: William A. Reinerth, Sanjay Malik, Binod B. De
  • Publication number: 20170260330
    Abstract: This disclosure relates to a polymer that includes a first repeat unit and at least one end-cap group at one end of the polymer. The first repeat unit includes at least one imide moiety and at least one indane-containing moiety. The end-cap group is capable of undergoing a cycloreversion reaction. This disclosure also relates to a thermosetting composition containing the above polymer.
    Type: Application
    Filed: May 30, 2017
    Publication date: September 14, 2017
    Inventors: Sanjay Malik, William A. Reinerth, Binod B. De, Ahmad A. Naiini
  • Publication number: 20170255100
    Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, a protective layer, and a polymeric layer between the carrier substrate and the protective layer. The polymeric layer includes at least one protected polybenzoxazole precursor polymer.
    Type: Application
    Filed: April 19, 2016
    Publication date: September 7, 2017
    Inventors: Sanjay Malik, William A. Reinerth