Patents by Inventor William A. Rioux

William A. Rioux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11466906
    Abstract: Disclosed is a heat transfer system with a module that includes a peripheral frame (10) and an electrocaloric element (46) disposed in an opening in the peripheral frame. The electrocaloric element includes an electrocaloric film (46), a first electrode (48) on a first side of the electrocaloric film, and a second electrode (50) on a second side of the electrocaloric film. First and second electrically conductive elements (24, 25) are disposed adjacent to first and second surfaces of the peripheral frame, and provide an electrical connection to the first and second electrodes.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: October 11, 2022
    Assignee: CARRIER CORPORATION
    Inventors: Wei Xie, Aritra Sur, Subramanyaravi Annapragada, William A. Rioux, Joseph V. Mantese, Parmesh Verma, Scott Alan Eastman, Thomas D. Radcliff
  • Patent number: 11448436
    Abstract: A method of making an electrocaloric element includes forming conductive layers on opposing surfaces of a film comprising an electrocaloric material to form an electrocaloric element, wherein the forming of the conductive layers includes one or more of: vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time under reduced pressure is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time of exposure to conductive material deposition is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure, wherein the reduced pressure is 10?8 torr to 500 torr; or maintaining the film at a temperature of less than or equal to 200° C. during forming of the conductive layers.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: September 20, 2022
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: Wei Xie, Subramanyaravi Annapragada, Joseph V. Mantese, Parmesh Verma, Thomas D. Radcliff, William A. Rioux
  • Publication number: 20210199352
    Abstract: A heat transfer system is disclosed that includes a plurality of supported electrocaloric film segments (46) arranged in a stack and connected to a frame (10). A working fluid flow path (44) extends through the stack, disposed between adjacent electrocaloric film segments. The working fluid flow path is in operative thermal communication with a heat sink and a heat source at opposite ends of the working fluid flow path. A plurality of electrodes are arranged to generate an electric field in the electrocaloric film segments, and are connected to a power source configured to selectively apply voltage to activate the electrodes in coordination with fluid flow along the working fluid flow path to transfer heat from the heat source to the heat sink. The heat transfer system further includes a film stress management mechanism.
    Type: Application
    Filed: August 21, 2019
    Publication date: July 1, 2021
    Inventors: Wei Xie, Joseph V. Mantese, Scott Alan Eastman, Subramanyaravi Annapragada, William A. Rioux, Parmesh Verma
  • Publication number: 20200309421
    Abstract: Disclosed is a heat transfer system with a module that includes a peripheral frame (10) and an electrocaloric element (46) disposed in an opening in the peripheral frame. The electrocaloric element includes an electrocaloric film (46), a first electrode (48) on a first side of the electrocaloric film, and a second electrode (50) on a second side of the electrocaloric film. First and second electrically conductive elements (24, 25) are disposed adjacent to first and second surfaces of the peripheral frame, and provide an electrical connection to the first and second electrodes.
    Type: Application
    Filed: September 28, 2018
    Publication date: October 1, 2020
    Inventors: Wei Xie, Aritra Sur, Subramanyaravi Annapragada, William A. Rioux, Joseph V. Mantese, Parmesh Verma, Scott Alan Eastman, Thomas D. Radcliff
  • Publication number: 20180375008
    Abstract: A method of making an electrocaloric element includes forming conductive layers on opposing surfaces of a film comprising an electrocaloric material to form an electrocaloric element, wherein the forming of the conductive layers includes one or more of: vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time under reduced pressure is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure for a duration of time, wherein the duration of time of exposure to conductive material deposition is less than 240 minutes; vapor deposition of the conductive layers under reduced pressure, wherein the reduced pressure is 10 torr to 500 torr; or maintaining the film at a temperature of less than or equal to 200° C. during forming of the conductive layers.
    Type: Application
    Filed: December 21, 2015
    Publication date: December 27, 2018
    Inventors: Wei Xie, Subramanyaravi Annapragada, Joseph V. Mantese, Parmesh Verma, Thomas D. Radcliff, William A. Rioux
  • Patent number: 7165605
    Abstract: A heat exchanger has a first thermally conductive tube for conducting a fluid and a second thermal conductive tube for conducting a fluid. The first thermally conductive tube forms a first loop while the second thermally conductive tube forms a second loop. The first loop neighbors the second loop.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: January 23, 2007
    Assignee: Carrier Corporation
    Inventors: Young Kyu Park, Gary D. Winch, William A. Rioux
  • Patent number: 7082785
    Abstract: A transcritical vapor compression system includes a compressor assembly that includes an oil separator for separating oil from refrigerant. The oil separator is disposed between a motor and a compression chamber in a sub-critical portion of the vapor compression system. Oil emitted from the drive assembly attached to the motor is substantially removed from the refrigerant before entering the compression chamber of the compressor.
    Type: Grant
    Filed: July 13, 2004
    Date of Patent: August 1, 2006
    Assignee: Carrier Corporation
    Inventors: Jeffrey J. Nieter, Tobias Sicnel, William A. Rioux
  • Publication number: 20060080988
    Abstract: A thin-profiled gas cooler and chassis suitable for a transcritical heat pump water heater are provided. The heat pump system includes a chassis for supporting such system components as a gas cooler and evaporator. The dimensions of the gas cooler are designed to minimize the impact that the gas cooler has on the cooling capacity of the evaporator by reducing the amount of air flow that the gas cooler blocks. This is achieved by reducing the depth that the gas cooler extends into the chassis cavity. As a result, the height and/or width of the gas cooler is increased compared to other similar volume gas coolers is providing comparable water heating capacity.
    Type: Application
    Filed: October 20, 2004
    Publication date: April 20, 2006
    Inventors: Lili Zhang, William Rioux
  • Publication number: 20060010904
    Abstract: A transcritical vapor compression system includes a compressor assembly that includes an oil separator for separating oil from refrigerant. The oil separator is disposed between a motor and a compression chamber in a sub-critical portion of the vapor compression system. Oil emitted from the drive assembly attached to the motor is substantially removed from the refrigerant before entering the compression chamber of the compressor.
    Type: Application
    Filed: July 13, 2004
    Publication date: January 19, 2006
    Inventors: Jeffrey Nieter, Tobias Sienel, William Rioux
  • Publication number: 20050103482
    Abstract: A heat exchanger has a first thermally conductive tube for conducting a fluid and a second thermal conductive tube for conducting a fluid. The first thermally conductive tube forms a first loop while the second thermally conductive tube forms a second loop. The first loop neighbors the second loop.
    Type: Application
    Filed: November 19, 2003
    Publication date: May 19, 2005
    Inventors: Young Park, Gary Winch, William Rioux
  • Publication number: 20030221434
    Abstract: The expansion of a high pressure or intermediate pressure refrigerant in an expansion device in a transcritical vapor compression system converts the potential energy into usable kinetic energy. The kinetic energy provides work which is employed to fully or partially drive an expansion motor unit which is coupled to rotating auxiliary machinery. By providing work to the rotating auxiliary machinery, system efficiency is improved. The auxiliary rotating machinery can be an evaporator fan or a gas cooler fan to pull the refrigerant through the evaporator and gas cooler, respectively. Alternatively, the auxiliary rotating machinery can be a water pump or an oil pump.
    Type: Application
    Filed: May 29, 2002
    Publication date: December 4, 2003
    Inventors: Jeff J. Neiter, Sivakumar Gopalnarayanan, J. Michael Griffin, William A. Rioux, Young K. Park, Russell G. Lewis
  • Patent number: 6647742
    Abstract: The expansion of a high pressure or intermediate pressure refrigerant in an expansion device in a transcritical vapor compression system converts the potential energy into usable kinetic energy. The kinetic energy provides work which is employed to fully or partially drive an expansion motor unit which is coupled to rotating auxiliary machinery. By providing work to the rotating auxiliary machinery, system efficiency is improved. The auxiliary rotating machinery can be an evaporator fan or a gas cooler fan to pull the refrigerant through the evaporator and gas cooler, respectively. Alternatively, the auxiliary rotating machinery can be a water pump or an oil pump.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: November 18, 2003
    Assignee: Carrier Corporation
    Inventors: Jeff J. Neiter, Sivakumar Gopalnarayanan, J. Michael Griffin, William A. Rioux, Young K. Park, Russell G. Lewis