Patents by Inventor William A. Rohr

William A. Rohr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic chip carrier compliant soldering pads
    Patent number: 4640499
    Abstract: Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes.
    Type: Grant
    Filed: May 1, 1985
    Date of Patent: February 3, 1987
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Paul F. Hemler, William A. Rohr