Abstract: A washing machine appliance and a method for operating a washing machine appliance are provided. The method includes directing a volume of liquid into a chamber of a basket, spinning the basket within a tub, and establishing a load type of articles within the chamber of the basket. The established load type is confirmed or controverted based at least in part on a height of liquid on a wall of the tub while the basket is spinning within the tub.

Abstract: Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.

Abstract: A movable frame is adapted to be loaded onto and unloaded from a stationary frame mounted on a vehicle. A platform is releasably mountable onto said movable frame. The platform and movable frame may be hoisted simultaneously when being loaded and unloaded from the stationary frame. The platform includes a downwardly depending support legs which are of sufficient length to maintain the platform elevated above a first portion of the movable frame which is inserted under said platform when said movable frame is resting in a lowered position when unloaded from the stationary frame. The movable frame may be raised to engage with the underside of said platform. Interlocks cooperate between said platform and said movable frame so that the movable frame centres onto and mates with said underside of said platform.

Abstract: Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

Abstract: A movable frame is adapted to be loaded onto and unloaded from a stationary frame mounted on a vehicle. A platform is releasably mountable onto said movable frame. The platform and movable frame may be hoisted simultaneously when being loaded and unloaded from the stationary frame. The platform includes a downwardly depending support legs which are of sufficient length to maintain the platform elevated above a first portion of the movable frame which is inserted under said platform when said movable frame is resting in a lowered position when unloaded from the stationary frame. The movable frame may be raised to engage with the underside of said platform. Interlocks cooperate between said platform and said movable frame so that the movable frame centers onto and mates with said underside of said platform.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

Abstract: Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

Abstract: Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

Abstract: A new and distinct variety of strawberry plant named ‘Buddy’ particularly characterized by an everbearing plant with good vigor, producing attractive, glossy berries with excellent eating quality, is disclosed.

Abstract: A support frame removably engageable with a wheelchair using no fasteners or tool-requiring engagement components. The support frame is slidably engaged and disengaged to the wheelchair by vertical translation. In an engaged position the weight of the support frame and anything attached thereto is born entirely by the rigid frame of the wheelchair through a positioning of support members of the frame in a frictional engagement atop the push handles of the wheelchair. So engaged, the support frame allows for easy transfer to other wheelchairs or easy removal and engagement from a collapsible wheelchair prior to or after transport of the wheelchair in a car or vehicle.

Abstract: Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

Abstract: Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Abstract: Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

Abstract: A movable frame is adapted to be loaded onto and unloaded from a stationary frame mounted on a vehicle. A platform is releasably mountable onto said movable frame. The platform and movable frame may be hoisted simultaneously when being loaded and unloaded from the stationary frame. The platform includes a downwardly depending support legs which are of sufficient length to maintain the platform elevated above a first portion of the movable frame which is inserted under said platform when said movable frame is resting in a lowered position when unloaded from the stationary frame. The movable frame may be raised to engage with the underside of said platform. Interlocks cooperate between said platform and said movable frame so that the movable frame centres onto and mates with said underside of said platform.

Abstract: A new and distinct variety of strawberry plant named ‘Buddy’ particularly characterized by an everbearing plant with good vigor, producing attractive, glossy berries with excellent eating quality, is disclosed.