Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.

Abstract: Photolithography masks, systems and methods and more particularly to photolithography masks systems and methods for making and using silicon dioxide mask substrates are disclosed. The mask generally includes a silicon-dioxide mask substrate having a front surface, a patterned layer disposed on the front surface, and a coating of a fluoride of an element of group IIA that covers the patterned layer. The coating reduces undesired crystal growth on the silicon dioxide mask substrate. Such masks can be incorporated into photolithography systems and used in photolithography methods wherein a layer of photoresist is formed on a substrate and to radiation that impinges on the mask. Such a mask can be fabricated, e.g., by forming a patterned layer on a front surface of a silicon dioxide mask substrate and covering the patterned layer with a coating of a fluoride of an element of group IIA.

Abstract: Photolithographic masks and nano-imprint lithography masks with calcium fluoride substrates are disclosed. A photolithographic mask has a calcium fluoride substrate having a surface, a patterned layer disposed on the surface, and a polymer layer forming a pellicle that covers the patterned layer. A mask for nano-imprint lithography has a calcium fluoride substrate with a surface and a nano-imprint lithography pattern formed on the surface. Such masks can be used in a method for reducing the effects of hydration during lithography. In the method a layer of photoresist is formed on a substrate. A mask having a substrate made of calcium fluoride with a patterned surface is disposed proximate the layer of photoresist. The photoresist is exposed to radiation that passes through the mask. The radiation is characterized by a vacuum wavelength between about 190 nm and about 450 nm. Calcium fluoride masks can also be used to reduce the effects of hydration nano-imprint lithography.

Abstract: Methods and apparatus relating to repair of mask defects through wafer plane modeling are described. In an embodiment, an updated edge location for a photomask is determined based on an image of the photomask and a comparison of contour of a corresponding wafer to physical design data of a corresponding device design. Other embodiments are also described.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.

Abstract: A mobile content publishing system and method. Enables creation, edit, upload, distribution and sale of ring tones, ringback tones, text, pictures, video or any other mobile content including music. Enables conversion of file formats depending on the playback device. Billing is performed for the creating user automatically. Users may sell and display content without dealing with the complexities of content formatting or billing. The system may also use a website with m-commerce capabilities that allows multiple consumers to purchase content. Editors such as a mixer may be used in one or more embodiments of the invention to create music or ring tones and ringback tones that are then uploaded to a publishing interface such as an e-commerce market for sale. The market may allow for revenue sharing between the market owner, the creator of the content or any other party involved in the distribution of media content.

Abstract: A B-hook retainer shaped and configured so as to maintain retention of B-hook hardware in a shaped aperture that secures various and multiple types of lading tie straps and strap hardware comprising of straps of woven webbing. The lading tie strap being held in place by the appropriate B-hook provision and the said anchor being contained within a pocket in the wall or floor of railway box or flat car. Various industry lading tie straps with said B-hook already in use are allowed to be connected to the shaped aperture anchor. An appropriate ratchet inherent to the specific type of tie strap being used is operated to remove any remaining slack in the lading ties and then apply the desired tension thereon to secure the lading to the railway car. If slack develops in the lading ties due to transport load shifting the B-hook retainer will prevent inadvertent removal of the B-hook from the shaped aperture resulting in lading tie strap no longer securing the lading to the railway car.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: A timed alert device for vehicles having an electronic timer that counts down a specified time period. An audible alert coupled to the electronic timer projects a sound when the electronic timer has reached a prescribed time. A first actuating element is coupled to the electronic timer which deactivates the audible alert when depressed. A power source is coupled to and supplies power to the electronic timer. A visual alert illuminates when the electronic timer has reached a prescribed time. Depressing a second actuating element deactivates the visual alert.

Abstract: A dry material and chemical impregnation unit for mixing the dry material and chemicals separately from a mixing and delivery system prior to delivering the mixture to a delivery unit. The impregnating unit can include a set of rotating mixing blades upon which the material, such as fertilizer and chemicals impinge. The impregnating unit also can include inclined walls upon which the dry materials or a dry and liquid material, such as the fertilizer and chemicals can impinge prior to or after passing through the mixing blades. The impregnating unit further can include a baffle upon which the dry material and chemicals impinge and pass therefrom to further inclined walls forming a restricted opening to turbulently mix the materials and chemicals, with or without the mixing blade.

Abstract: Low rank coals such as subbituminous or lignites containing more than about 10 wt. % moisture are first dried and then passed to a fluidized bed where the coal is passivated against reabsorption of moisture by coating the warm coal particles with a heavy liquid hydrocarbon material. Such coating substantially prevents the reabsorption of moisture in the coal, and thereby prevents autogenous heating and possible spontaneous ignition during subsequent transportation or storage of the passivated coal.

Abstract: The capacity and effectiveness of a fluidized multi-bed process for the direct reduction of broad size-range metallic oxides, such as ion oxide particles, can be materially improved by feeding the large-size particles into the uppermost zone and the fine-particle material such as bag dust to the lowest zone of a multiple bed reducer. The larger particles in the upper zones tend to restrain the fine particles from being carried out of the reducer by upwardly flowing reducing gas. In the lower zone location, complete reduction of the fine oxide particles is much more effective, as the reaction is initiated by the fresh reducing gas, which is normally high purity hydrogen.