Abstract: A robotic grasping system includes an end effector, a camera configured to capture a feed, a gripper mechanism, and a computing system configured to receive the feed from the camera and to perform operations based at least partially upon the feed. The operations include identifying a target object on a payload in the feed. The operations also include identifying a final position within a bounding box in which to search for the target object. The operations also include assigning locations of features at the final position in the bounding box of the feed. The operations also include identifying a pose of the end effector with respect to the final position based at least partially upon the locations of the features. The operations also include determining a translation to move the end effector from the final position into a grasping envelope that is in alignment with the target object.

Abstract: During a financial technique, an instance of an application executing on an initiating electronic device initiates the financial transaction by communicating information with a receiving electronic device. Then, the application selects a financial account that provides funds for the financial transaction. This financial account may be one of multiple different types of financial accounts that are associated with different providers. Moreover, the application conducts the financial transaction by providing a message to the receiving electronic device, where the message includes an amount of funds transferred in the financial transaction. After receiving the message, an instance of the application executing on the receiving electronic device selects another financial account that receives the funds for the financial transaction, where the other financial account is one of multiple different types of financial accounts that are associated with different providers.

Abstract: A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed from a lead frame which contains the four leads of the capacitor (two of which are electrically inactive) on a single plane. The use of a lead frame automatically provides the dimensional tolerances necessary for encapsulation molding of the decoupling capacitor. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a single layer ceramic capacitor, active leads bonded to the capacitor and dummy pins for auto-insertion into printed circuit boards.

Abstract: A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed and consists of a molded housing with integrally molded recesses for a capacitive ceramic chip. The housing also is formed with integrally molded recesses and stabilizing tabs for active pins; and either molded recesses and stabilizing tabs for dummy pins, or molded lugs in lieu of dummy pins.