Patents by Inventor William A. Webster

William A. Webster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8343369
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 1, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
  • Publication number: 20110266639
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 3, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
  • Publication number: 20080225505
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Application
    Filed: May 29, 2008
    Publication date: September 18, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: John R. Martin, Manolo G. Mena, Elmer S. Lacsamana, Michael P. Duffy, William A. Webster, Lawrence E. Felton, Maurice S. Karpman
  • Patent number: 6893574
    Abstract: A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: May 17, 2005
    Inventors: Lawrence E. Felton, Peter W. Farrell, Jing Luo, David J. Collins, John R. Martin, William A. Webster
  • Publication number: 20030075794
    Abstract: A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.
    Type: Application
    Filed: October 23, 2001
    Publication date: April 24, 2003
    Inventors: Lawrence E. Felton, Peter W. Farrell, Jing Luo, David J. Collins, John R. Martin, William A. Webster