Patents by Inventor William A. Wentland, Jr.

William A. Wentland, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enclosure for an electronic circuit module
    Patent number: 5461541
    Abstract: An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves.
    Type: Grant
    Filed: February 22, 1994
    Date of Patent: October 24, 1995
    Assignee: Dana Corporation
    Inventors: William A. Wentland, Jr., Alan M. Hansen, Ramon W. Rosati