Abstract: Devices, systems and methods for removing heat from subcutaneously disposed lipid-rich cells are disclosed. In selected embodiments, suction and/or heat removal sources are coupled to an applicator. The applicator includes a flexible portion and a rigid portion. The rigid portion includes a thermally conductive plate and a frame coupling the thermally conductive plate and the flexible portion. An interior cavity of the applicator is in fluid communication with the suction source, and the frame maintains contiguous engagement between the heat removal source and the thermally conductive plate.

Abstract: A system for currency conversion comprising a currency with at least one denomination, at least one electronic cash register adapted to receive and retain at least one currency further having a module in communication with each register, at least one user device in communication with at least one module, the device including at least one user controllable command, user identification information, and system authentication information, at least one user account adapted to receive and retain the value associated with at least one currency-paid transaction processed by at least one register, at least one redemption outlet adapted to allow at least one user to apply any value in their user account to a desired purpose whereby each user retains the value associated with currency-paid transactions without the necessity of receiving and dealing with physical currency.

Abstract: Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

Abstract: In situations where the demand for syngas is intermittent, a fuel processor is operated to provide a high absolute hydrogen and carbon monoxide production, rather than to give a high fuel-specific hydrogen and carbon monoxide production. When a syngas generator is operated to intermittently produce syngas, a heating process can be performed between periods of syngas demand in order to keep the fuel processor within a desired temperature range. The heating process can comprise various steps or events including performing a heating event, allowing a standby period, and/or performing a carbon conversion event. Carbon formed during the process of converting fuel to syngas can be advantageously converted to maintain the temperature of the fuel processor within a desired range in between periods of syngas demand. A predictive method can be employed to control at least a portion of the heating process.

Abstract: In situations where the demand for syngas is prolonged, a fuel processor is operated continuously to provide a syngas stream for a prolonged period. The equivalence ratio of reactants supplied to the fuel processor is controlled so that a high fuel-conversion efficiency to hydrogen and carbon monoxide is obtained at temperatures correspondent to carbon production balance, where carbon is formed and gasified at approximately the same rate in the fuel processor.

Abstract: A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing l

Abstract: A fuel processor for producing a hydrogen-containing product stream from a fuel stream and an oxidant stream, comprises a mixing tube from which the combined fuel and oxidant stream is directed substantially axially into a reaction chamber. The reaction chamber comprises a turn-around chamber and a turn-around wall at one end for re-directing the combined reactant stream, so that in the turn-around chamber the re-directed stream surrounds and is in contact with the combined reactant stream flowing substantially axially in the opposite direction. This design and opposing flow configuration creates a low velocity zone which stabilizes the location of a flame in the fuel processor and offers other advantages.

Abstract: In situations where the demand for syngas is intermittent, a fuel processor is operated to provide a high absolute hydrogen and carbon monoxide production, rather than to give a high fuel-specific hydrogen and carbon monoxide production. When a syngas generator is operated to intermittently produce syngas, a heating process can be performed between periods of syngas demand in order to keep the fuel processor within a desired temperature range. The heating process can comprise various steps or events including performing a heating event, allowing a standby period, and/or performing a carbon conversion event. Carbon formed during the process of converting fuel to syngas can be advantageously converted to maintain the temperature of the fuel processor within a desired range in between periods of syngas demand. A predictive method can be employed to control at least a portion of the heating process.

Abstract: In situations where the demand for syngas is prolonged, a fuel processor is operated continuously to provide a syngas stream for a prolonged period. The equivalence ratio of reactants supplied to the fuel processor is controlled so that a high fuel-conversion efficiency to hydrogen and carbon monoxide is obtained at temperatures correspondent to carbon production balance, where carbon is formed and gasified at approximately the same rate in the fuel processor.

Abstract: Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.

Abstract: A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area; (b) an aperture-free removable release sheet covering at least a portion of said back surface of the polishing l

Abstract: In methods for starting a fuel processor, the equivalence ratio of reactants supplied to the fuel processor is controlled in a step-wise procedure to rapidly heat the fuel processor, and optionally sustain it within a desired temperature range until a hydrogen-containing gas stream is needed.

Abstract: A fuel processor for producing a hydrogen-containing product stream from a fuel stream and an oxidant stream, comprises a mixing tube from which the combined fuel and oxidant stream is directed substantially axially into a reaction chamber. The reaction chamber comprises a turn-around chamber and a turn-around wall at one end for re-directing the combined reactant stream, so that in the turn-around chamber the re-directed stream surrounds and is in contact with the combined reactant stream flowing substantially axially in the opposite direction. This design and opposing flow configuration creates a low velocity zone which stabilizes the location of a flame in the fuel processor and offers other advantages.

Abstract: The over-running clutch pulley (10) of a preferred embodiment of the invention includes a sheave member (20), a hub member (22) located substantially concentrically within the sheave member, and a clutch member (24), which cooperate to rotationally engage an input device (12) and an output device (14). The sheave member preferably includes a sheave input section (26) adapted to engage the input device, and a sheave clutch section (28) defining a sheave clutch surface (30). Similarly, the hub member preferably includes a hub output section (32) adapted to engage the output device, and a hub clutch section (34) defining a hub clutch surface (36). In the preferred embodiment, either the sheave clutch surface, the hub clutch surface, or both, have a surface microhardness greater than the hub output section.

Abstract: The present invention relates to an article for altering a surface of a work piece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: A polishing pad including a window can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind the particulate polymer together, wherein said organic polymer binder can be prepared in-situ . The particulate polymer and organic polymer binder can be distributed substantially across the work surface the polishing pad, and the pad can have a percent pore volume of from 2 percent by volume to 50 percent by volume, based on the total volume of said polishing pad.

Abstract: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Abstract: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.