Patents by Inventor William Anthony Drennen

William Anthony Drennen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8946939
    Abstract: Embodiments are directed to detecting and limiting power transfer to communication device, such as NFC and RFID cards. A method may include detecting one or more communication devices positioned within a wireless power transfer region of a wireless power transmitter. The method may further include limiting an amount of power transmitted by a transmitter in response to the detection.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 3, 2015
    Assignee: QUALCOMM Incorporated
    Inventor: William Anthony Drennen
  • Publication number: 20120248891
    Abstract: Embodiments are directed to detecting and limiting power transfer to communication device, such as NFC and RFID cards. A method may include detecting one or more communication devices positioned within a wireless power transfer region of a wireless power transmitter. The method may further include limiting an amount of power transmitted by a transmitter in response to the detection.
    Type: Application
    Filed: January 17, 2012
    Publication date: October 4, 2012
    Applicant: QUALCOMM Incorporated
    Inventor: William Anthony Drennen
  • Patent number: 6222741
    Abstract: A thin, compliant, electrically and thermally conductive aluminum shim for providing minimum distance circuit path from a power amplifier (or transistor) to the underside of the circuit board (ground). The aluminum shim creates an interference fit between the underside of the circuit board and chassis, which guarantees an electrical connection with the bottom of amplifier and underside of the circuit board. Additionally, with the present invention, post-machining of the chassis during assembly of components is not required since the aluminum shim is sufficiently compliant to conform to both the bottom surface of the amplifier and the existent flatness and surface finish on the chassis produced from the initial machining step. This ensures superior electrical and thermal contact to the chassis regardless of slight imperfections in chassis flatness and surface finish at the seat location, thereby improving reliability and decreasing cost of manufacture and assembly.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: April 24, 2001
    Assignee: Qualcomm Incorporated
    Inventors: William Anthony Drennen, David C. Stillinger