Patents by Inventor William B. Budinger

William B. Budinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
    Publication number: 20020098702
    Abstract: An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution which may be recirculated, analyzed, adjusted, and from which soluble reaction products may be removed.
    Type: Application
    Filed: February 1, 2002
    Publication date: July 25, 2002
    Inventors: Lee Melbourne Cook, David B. James, William B. Budinger