Patents by Inventor William B. Dial

William B. Dial has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10720136
    Abstract: An acoustic attenuation device includes resonator panels stacked in a thickness direction of the device. Each resonator panel is tuned to a different frequency range and includes a plurality of openings through which excited air resonates. The resonator panels are placed adjacent to other resonator panels such that all openings are accessible to the environment.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: July 21, 2020
    Assignee: ZIN TECHNOLOGIES, INC.
    Inventors: Bart F. Zalewski, William B. Dial
  • Patent number: 10657947
    Abstract: An acoustic attenuation assembly includes a low frequency sound attenuation device having at least one sound attenuation chamber containing a volume and mass of air. First and second openings are associated with each low frequency chamber through which excited air resonates. The first and second openings extend through the first sheet into each low frequency chamber. Each chamber has an open side. A high frequency sound attenuation device is secured to the low frequency attenuation device and closes the open side of each chamber. The high frequency sound attenuation device includes a plurality of projections formed from a sound absorbing material that absorbs excited air.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: May 19, 2020
    Assignee: ZIN TECHNOLOGIES, INC.
    Inventors: Bart F. Zalewski, William B. Dial, Arthur J. Birchenough
  • Publication number: 20190172437
    Abstract: An acoustic attenuation device includes resonator panels stacked in a thickness direction of the device. Each resonator panel is tuned to a different frequency range and includes a plurality of openings through which excited air resonates. The resonator panels are placed adjacent to other resonator panels such that all openings are accessible to the environment.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 6, 2019
    Inventors: BART F. ZALEWSKI, WILLIAM B. DIAL
  • Publication number: 20190051281
    Abstract: An acoustic attenuation assembly includes a low frequency sound attenuation device having at least one sound attenuation chamber containing a volume and mass of air. First and second openings are associated with each low frequency chamber through which excited air resonates. The first and second openings extend through the first sheet into each low frequency chamber. Each chamber has an open side. A high frequency sound attenuation device is secured to the low frequency attenuation device and closes the open side of each chamber. The high frequency sound attenuation device includes a plurality of projections formed from a sound absorbing material that absorbs excited air.
    Type: Application
    Filed: August 10, 2017
    Publication date: February 14, 2019
    Inventors: BART F. ZALEWSKI, WILLIAM B. DIAL, ARTHUR J. BIRCHENOUGH
  • Patent number: 9378721
    Abstract: A method of manufacturing an acoustic attenuation device includes three-dimensionally printing a pair of sheets and webs that cooperate with the sheets to define attenuation chambers. Each chamber has at least one opening through which excited air resonates.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: June 28, 2016
    Assignee: ZIN TECHNOLOGIES, INC.
    Inventors: Bart F. Zalewski, William B. Dial
  • Publication number: 20150122577
    Abstract: A method of manufacturing an acoustic attenuation device includes three-dimensionally printing a pair of sheets and webs that cooperate with the sheets to define attenuation chambers. Each chamber has at least one opening through which excited air resonates.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: BART F. ZALEWSKI, WILLIAM B. DIAL
  • Patent number: 8663770
    Abstract: A method of forming a composite structure can include providing a plurality of composite panels of material, each composite panel having a plurality of holes extending through the panel. An adhesive layer is applied to each composite panel and a adjoining layer is applied over the adhesive layer. The method also includes stitching the composite panels, adhesive layer, and adjoining layer together by passing a length of a flexible connecting element into the plurality of holes in the composite panels of material. At least the adhesive layer is cured to bond the composite panels together and thereby form the composite structure.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: March 4, 2014
    Assignee: Zin Technologies, Inc.
    Inventors: Bart F. Zalewski, William B. Dial
  • Publication number: 20120276320
    Abstract: A method of forming a composite structure can include providing a plurality of composite panels of material, each composite panel having a plurality of holes extending through the panel. An adhesive layer is applied to each composite panel and a adjoining layer is applied over the adhesive layer. The method also includes stitching the composite panels, adhesive layer, and adjoining layer together by passing a length of a flexible connecting element into the plurality of holes in the composite panels of material. At least the adhesive layer is cured to bond the composite panels together and thereby form the composite structure.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 1, 2012
    Inventors: Bart F. Zalewski, William B. Dial