Patents by Inventor William B. H. Grace
William B. H. Grace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10845282Abstract: A test coupon having node bonds is disclosed. In some aspects, the method includes a first foil and a second foil, stripes of adhesive serially disposed across a width of the first foil or the second foil and coupling the first foil and second foil to one another to form node bonds, and a first adherend coupled to the first foil and a second adherend coupled to the second foil such that the first foil and the second foil are provided between the first adherend and the second adherend, the first adherend and the second adherend being connectable to load blocks of a test apparatus capable of loading the test coupon to determine characteristics of each of the node bonds formed from the stripes of adhesive. A method for testing node bonds and a related apparatus are also disclosed.Type: GrantFiled: February 22, 2017Date of Patent: November 24, 2020Assignee: THE BOEING COMPANYInventors: Matthew Anthony Dilligan, William B. H. Grace, Brice Thompson Collamer, Joe M. Walters, Randy Jay Grove
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Publication number: 20180238786Abstract: A test coupon having node bonds is disclosed. In some aspects, the method includes a first foil and a second foil, stripes of adhesive serially disposed across a width of the first foil or the second foil and coupling the first foil and second foil to one another to form node bonds, and a first adherend coupled to the first foil and a second adherend coupled to the second foil such that the first foil and the second foil are provided between the first adherend and the second adherend, the first adherend and the second adherend being connectable to load blocks of a test apparatus capable of loading the test coupon to determine characteristics of each of the node bonds formed from the stripes of adhesive. A method for testing node bonds and a related apparatus are also disclosed.Type: ApplicationFiled: February 22, 2017Publication date: August 23, 2018Inventors: Matthew Anthony Dilligan, William B. H. Grace, Brice Thompson Collamer, Joe M. Walters, Randy Jay Grove
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Patent number: 8812251Abstract: The disclosure provides in one embodiment a system for monitoring adhesive integrity within a cured bondline of a bonded structural assembly. The system comprises a bonded structural assembly having a cured bondline. The cured bondline comprises an adhesive layer, a scrim ply layer integrated with the adhesive layer, and an electrical sensor network integrated with the scrim ply layer. The system further comprises an electrical power source for providing electrical power to the electrical sensor network. The system further comprises a digital data communications network for retrieving and processing data from the electrical sensor network. The electrical sensor network monitors adhesive integrity on demand by interpreting changes in local dynamic responses and electromechanical properties directly measured within the cured bondline.Type: GrantFiled: April 12, 2011Date of Patent: August 19, 2014Assignee: The Boeing CompanyInventors: Jeong-Beom Ihn, Jonathan Henry Gosse, Kay Y. Blohowiak, William B. H. Grace
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Patent number: 8365502Abstract: A structural member such as a strut includes a composite material tube having metal end fittings that are attached to the tube by co-bonded, double shear joints. The double shear bond joint construction reduces the residual stress on the bonds that result from mismatch of the coefficients of thermal expansion of the composite tube and the metal end fittings. The ends of the fittings that are bonded to the tube may include a stepped profile that functions to limit the peak stresses in the bonds.Type: GrantFiled: May 11, 2007Date of Patent: February 5, 2013Assignee: The Boeing CompanyInventors: Christopher T. Allen, Patrick D. Bertrand, Derek J. Fox, William B. H. Grace, Kenneth M. Harrison, Wesley L. Holman, Menelaos S. Kafkalidis, James R. Schnelz, Edward M. Fisher
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Publication number: 20120265449Abstract: The disclosure provides in one embodiment a system for monitoring adhesive integrity within a cured bondline of a bonded structural assembly. The system comprises a bonded structural assembly having a cured bondline. The cured bondline comprises an adhesive layer, a scrim ply layer integrated with the adhesive layer, and an electrical sensor network integrated with the scrim ply layer. The system further comprises an electrical power source for providing electrical power to the electrical sensor network. The system further comprises a digital data communications network for retrieving and processing data from the electrical sensor network. The electrical sensor network monitors adhesive integrity on demand by interpreting changes in local dynamic responses and electromechanical properties directly measured within the cured bondline.Type: ApplicationFiled: April 12, 2011Publication date: October 18, 2012Applicant: The Boeing CompanyInventors: Jeong-Beom Ihn, Jonathan Henry Gosse, Kay Y. Blohowiak, William B. H. Grace
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Publication number: 20080129041Abstract: A structural member such as a strut includes a composite material tube having metal end fittings that are attached to the tube by co-bonded, double shear joints. The double shear bond joint construction reduces the residual stress on the bonds that result from mismatch of the coefficients of thermal expansion of the composite tube and the metal end fittings. The ends of the fittings that are bonded to the tube may include a stepped profile that functions to limit the peak stresses in the bonds.Type: ApplicationFiled: May 11, 2007Publication date: June 5, 2008Inventors: Christopher T. Allen, Patrick D. Bertrand, Derek J. Fox, William B.H. Grace, Kenneth M. Harrison, Wesley L. Holman, Menelaso S. Kafkalidis, James R. Schnelz, Edward M. Fisher
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Patent number: 6797376Abstract: The present invention provides a metallic member reinforcing epoxy-based adhesive coating. The epoxy-based adhesive coating including a first epoxy material containing approximately 25% solids by weight and a second curative material containing about 32% solids by weight. According to one aspect of the present invention, the first epoxy offered suitably includes about 3% to about 35% liquid Diglycidylether of Bisphenol-A, about 35% to about 60% solid Diglycidylether of Bisphenol-A, about 10% to about 30% Novolac-Epoxy, and about 5% to about 18% Solid Carboxy—Terminated Acrylonitrile—Butadiene Rubber, and the second curative material suitably includes about 0% to about 100% 4,4′-Diaminodiphenylsulfone, about 0% to about 100% 3,3′-Diaminodiphenylsulfone, and about 0% to about 0.2% Chromium octoate.Type: GrantFiled: May 9, 2002Date of Patent: September 28, 2004Assignee: The Boeing CompanyInventors: Robert A. Anderson, William B. H. Grace, Stephen R. Barnes, Matthew S. Tillman, Kay Y. Blohowiak
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Publication number: 20040178178Abstract: Apparatus and process for continuous surface preparation of metal materials. The metal material is grit blasted with a mixture of fine particles of aluminum oxide in air and water. The metal material is rinsed with water to remove the grit. The metal material is subjected to a caustic solution of sodium hydroxide and then rinsed with water to remove the caustic solution of sodium hydroxide. A sol-gel coating is applied to the metal material and the water portion of the sol-gel coating is evaporated. A liquid adhesive coating is applied to the sol-gel coating on the metal material and the solvent portion of the adhesive coating is evaporated.Type: ApplicationFiled: January 2, 2004Publication date: September 16, 2004Inventors: Kay Y. Blohowiak, Robert A. Anderson, Shane E. Arthur, William B. H. Grace, Darrin M. Hansen, Steven R. Jones, Matthew S. Tillman, Rick G. Wire
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Publication number: 20030211318Abstract: The present invention provides a metallic member reinforcing epoxy-based adhesive coating. The epoxy-based adhesive coating including a first epoxy material containing approximately 25% solids by weight and a second curative material containing about 32% solids by weight. According to one aspect of the present invention, the first epoxy offered suitably includes about 3% to about 35% liquid Diglycidylether of Bisphenol-A, about 35% to about 60% solid Diglycidylether of Bisphenol-A, about 10% to about 30% Novolac-Epoxy, and about 5% to about 18% Solid Carboxy-Terminated Acrylonitrile-Butadiene Rubber, and the second curative material suitably includes about 0% to about 100% 4,4′-Diaminodiphenylsulfone, about 0% to about 100% 3,3′-Diaminodiphenylsulfone, and about 0% to about 0.2% Chromium Octotate.Type: ApplicationFiled: May 9, 2002Publication date: November 13, 2003Inventors: Robert A. Anderson, William B.H. Grace, Stephen R. Barnes, Matthew S. Tillman, Kay Y. Blohowiak
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Publication number: 20030211330Abstract: A method of treating a metal material to increase the metal's ability to adhere to other objects is provided. The metal material is prepared to receive a sol-gel solution coating. A sol-gel solution is prepared and the sol-gel solution is applied to the metal material. Subsequently, an epoxy-based adhesive coating is applied over the sol-gel solution, thereby creating an adhesive layer on the metal material.Type: ApplicationFiled: May 9, 2002Publication date: November 13, 2003Inventors: Robert A. Anderson, William B.H. Grace, Matthew S. Tillman, Shane E. Arthur, Darrin M. Hansen, Rick G. Wire, Kay Y. Blohowiak, Steven R. Jones