Abstract: A resistor structure (10) having a heating element (35) and a resistor (32), and a method of trimming the resistor (32). The heating element (35) is separated from the resistor (32) by a layer of dielectric material (19). The resistor (32) has a layer of resistive material (23) on an etch control layer (22). The resistor (32) is trimmed by providing current pulses (62) through the heating element (35). Heat generated by the current pulses flows to the resistor (32) and anneals or trims the resistor (32). A resistor trimming variable, e.g. a voltage across resistor contacts (30, 31), is monitored and the current pulses are modulated in accordance with the value of the resistor trimming variable (63). The trimming step is terminated when the desired resistance value of the resistor (32) is attained.

Abstract: A resistor structure (10) having a heating element (35) and a resistor (32), and a method of trimming the resistor (32). The heating element (35) is separated from the resistor (32) by a layer of dielectric material (19). The resistor (32) has a layer of resistive material (23) on an etch control layer (22). The resistor (32) is trimmed by providing current pulses (62) through the heating element (35). Heat generated by the current pulses flows to the resistor (32) and anneals or trims the resistor (32). A resistor trimming variable, e.g. a voltage across resistor contacts (30, 31), is monitored and the current pulses are modulated in accordance with the value of the resistor trimming variable (63). The trimming step is terminated when the desired resistance value of the resistor (32) is attained.

Abstract: A miniature vacuum chamber that is capable of testing individual dice prior to packaging is described. The upper portion of the chamber consists of a housing having testing probes and a vacuum inlet disposed therein. The lower portion of the chamber consists of a chuck that holds a wafer and a lower vacuum chamber. The lower portion is indexed to place a dice in contact with the probes. The upper and lower portions then form a seal and a vacuum is drawn in the area defined by the upper and lower chambers. The dice is then tested; the area pressurized; and the chuck indexed to test the next dice.

Abstract: The present invention consists of a miniature vacuum chamber that is capable of testing individual dice prior to packaging. The upper portion of the chamber consists of a housing having testing probes and a vacuum inlet disposed therein. The lower portion of the chamber consists of a chuck that holds a wafer and a lower vacuum chamber. The lower portion is indexed to place a dice in contact with the probes. The upper and lower portions then form a seal and a vacuum is drawn in the area defined by the upper and lower chambers. The dice is then tested; the area pressurized; and the chuck indexed to test the next dice.