Patents by Inventor William B. Reid

William B. Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5420208
    Abstract: Esters which are substantially non acidic esters of P or S oxyacids, especially phosphite ester antioxidants, are curing catalysts for the moisture curing of silyl polymers such as polyethylene carrying pendant trialkoxysilyl groups. The esters catalyse cross linking without causing significant precure.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: May 30, 1995
    Assignee: Neste Oy
    Inventor: William B. Reid
  • Patent number: 5315472
    Abstract: An electrostatic discharge structure protection structure formed on an interconnect circuit (20) that includes elongated interconnect lines (13) and interconnect contact pads (17) formed on a dielectric substrate (11) wherein portions of the interconnect circuit are subject to physical contact by a person. The electrostatic discharge protection structure includes an interconnected conductive grounding metallization ground pattern that includes a ground ring pattern (19) adjacent selected edges of the perimeter of the substrate and conductive metallization traces (29) adjacent selected edges of openings in the substrate. The electrostatic discharge protection structure further includes spark gaps (23a, 23b) formed between the interconnect pads and the conductive grounding pattern, and grounding pads (25') exposed by openings in the substrate.
    Type: Grant
    Filed: July 23, 1991
    Date of Patent: May 24, 1994
    Assignee: Hewlett Packard Company
    Inventors: Jon J. Fong, William B. Reid