Abstract: Techniques and mechanisms for dynamically changing a distribution of credits with which initiator agents of a network access a shared target resource of the network. In various embodiments, a target agent and multiple initiator agents are coupled to each other via a switched network, and further via a credit management bus (CMB). The target agent manages a credit-based scheme according to which the initiator agents share access to a target resource. Communications via the CMB enable the target agent to determine, during a runtime of the network, whether a given initiator agent has been allocated an excessive number of credits, or an insufficient number of credits. In another embodiments, the target agent changes the distribution of credits to the initiator agents by allocating credits via the CMB.

Abstract: Various embodiments of methods and systems for bit flip identification for debugging and/or power management in a system on a chip (“SoC”) are disclosed. Exemplary embodiments seek to identify bit flip occurrences near in time to the occurrences by checking parity values of data blocks as the data blocks are written into a memory component. In this way, bit flips occurring in association with a write transaction may be differentiated from bit flips occurring in association with a read transaction. The distinction may be useful, when taken in conjunction with various parameter levels identified at the time of a bit flip recognition, to debug a memory component or, when in a runtime environment, adjust thermal and power policies that may be contributing to bit flip occurrences.

Abstract: Various embodiments of methods and systems for bit flip identification for debugging and/or power management in a system on a chip (“SoC”) are disclosed. Exemplary embodiments seek to identify bit flip occurrences near in time to the occurrences by checking parity values of data blocks as the data blocks are written into a memory component. In this way, bit flips occurring in association with a write transaction may be differentiated from bit flips occurring in association with a read transaction. The distinction may be useful, when taken in conjunction with various parameter levels identified at the time of a bit flip recognition, to debug a memory component or, when in a runtime environment, adjust thermal and power policies that may be contributing to bit flip occurrences.

Abstract: Various embodiments of methods and systems for bit flip identification for debugging and/or power management in a system on a chip (“SoC”) are disclosed. Exemplary embodiments seek to identify bit flip occurrences near in time to the occurrences by checking parity values of data blocks as the data blocks are written into a memory component. In this way, bit flips occurring in association with a write transaction may be differentiated from bit flips occurring in association with a read transaction. The distinction may be useful, when taken in conjunction with various parameter levels identified at the time of a bit flip recognition, to debug a memory component or, when in a runtime environment, adjust thermal and power policies that may be contributing to bit flip occurrences.

Abstract: A method for communication between a sender and a receiver, including receiving data in the form of an M-of-N code, where the M-of-N code includes a first component of length n1 and a second component of length n2; decoding data in which the first component is an m1-of-n1 code and the second component is an m2-of-n2 code; and decoding data in which the first component is an m3-of-n1 code where m1?m3 and the second component is an m4-of-n2 code where m2?m4.

Abstract: An automotive headliner comprised of a laminate of double corrugated paperboard. Perforations in all the sheets of the laminate except the back paperboard sheet improve the acoustical performance of the liner. A vapor barrier on the back sheet prevents entry of moisture into the laminate from the roof, and a layer of sound dampening material on the front face of the laminate improves the sound absorption of the laminate. The front corrugation is larger than the back corrugation. When molding the laminate it is first moisturized, then heat molded. Heat is applied until the laminate has regained its rigidity.