Abstract: A controller for a first vehicle is configured to, when a security system of the first vehicle is activated, transmit a vehicle-to-vehicle signal to a second vehicle, the signal comprising instructions that, when executed by a controller of the second vehicle, cause the controller of the second vehicle to activate a security system of the second vehicle. A method includes determining whether a security system of a first vehicle is activated and, if it is determined that the security system is activated, transmitting a vehicle-to-vehicle signal to a second vehicle, the signal comprising instructions that, when executed by a controller of the second vehicle, cause the controller of the second vehicle to activate a security system of the second vehicle.

Abstract: A controller for a first vehicle is configured to, when a security system of the first vehicle is activated, transmit a vehicle-to-vehicle signal to a second vehicle, the signal comprising instructions that, when executed by a controller of the second vehicle, cause the controller of the second vehicle to activate a security system of the second vehicle. A method includes determining whether a security system of a first vehicle is activated and, if it is determined that the security system is activated, transmitting a vehicle-to-vehicle signal to a second vehicle, the signal comprising instructions that, when executed by a controller of the second vehicle, cause the controller of the second vehicle to activate a security system of the second vehicle.

Abstract: A cooking utensil for use with a cooking appliance having a hingedly mounted cover includes a food engaging portion; and a shaft mounted on the food engaging portion and which supports the cover in a given spaced orientation relative to the cooking appliance.

Abstract: The present invention provides a method for forming thermal, mechanical and electrical connections between circuit traces in different layers of a multilayer electronic assembly. The method includes the steps of providing circuit layers with circuit traces of appropriately chosen metal, aligning the layers to form a lay up and exposing the lay up to selected conditions of temperature and pressure, over a period of time, sufficient to fuse the circuit layers to each other and to diffusion bond weld the circuit traces to each other. The present invention also provides a multilayer electronic assembly having circuit trace bonds formed according to the method of the present invention.