Abstract: The invention is an assembly and method for bonding an optical component to a base member. The component is mounted to a block which includes a centerline extending between two opposing surfaces. A pair of stop members are included on the surface of the base member, and these members serve to pin the centerline during heating and cooling of the assembly so that the position of the component is controlled.

Abstract: A method for testing the reliability of fiber-optic laser modules by determining the change in position over time of the focal point of the fiber tip relative to the laser, wherein the coupling efficiency and influence coefficients of the laser module are used to determine whether the focal point of the fiber tip is moving relative to the laser at an unacceptable rate of displacement such that the laser module is likely to malfunction and is therefore unacceptable for use.

Abstract: A method for nondestructively and accurately determining the stress of a fabricated semiconductor chip soldered, brazed or otherwise bonded to a submount using optical microscopy and finite element analysis. Deformations on a top surface of the semiconductor chip are first examined using optical microscopy. The deformations are then correlated using finite element analysis to the stress on the semiconductor chip caused by the soldering process. If the stress is determined to be within an acceptable range of measurement, then the semiconductor chip will have been properly soldered to the submount and can be used.

Abstract: The present invention disclose a method comprising the steps of fixing a first device to a first housing using a first manufacturing process and fixing a second device to a first housing using a second manufacturing process. The first device can be a laser and the second device an optical fiber. After the first and second device have been fixed to the first housing, the first device lies at a first position relative to the second device. The first device, the second device, and the first housing comprise a first sample. The first sample can be flexed by an amount y1. The first sample is next subjected to a deterioration process such as baking. After the deterioration process it is determined whether the first device lies within a range of the first position relative to the second device. The method may also comprise fixing a third device and a fourth device to a second housing using the same first and second manufacturing processes as for the first sample.

Abstract: A method for maximizing the coupling efficiency of a fabricated fiber-optic laser module by deforming the module. In a first embodiment, the method can use a plurality of previously determined influence coefficients to determine how to deform the module, wherein such deformation aligns the focal point of the optical fiber and the laser to maximize the coupling efficiency. Alternatively, in a second embodiment of the present invention, the method is implemented without the use of influence coefficients, wherein the changes in the coupling efficiency resulting from deforming the module are observed to determine which deformations will maximize the coupling efficiency. Irrespective of which embodiment of the present invention is used, the module is deformed to account for its elastic properties by deforming the module beyond the final shape it attains when the coupling efficiency is maximized.

Abstract: The invention is an assembly and method for bonding an optical component to a base member. The component is mounted to a block which includes a centerline extending between two opposing surfaces. A pair of stop members are included on the surface of the base member, and these members serve to pin the centerline during heating and cooling of the assembly so that the position of the component is controlled.