Abstract: A safety barrier for use with a play apparatus such as a trampoline includes at least one support pole and a barrier element. A portion of the barrier element is detachably connectable directly or indirectly to the support pole, the barrier element having an erect configuration and a collapsed configuration. In the erect configuration the portion of the barrier element is connected directly or indirectly to the support pole and in the collapsed configuration the portion of the barrier element is not connected directly or indirectly to the support pole.

Abstract: An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line. In a first embodiment the compressive member comprises an elongated bar-shaped member that extends across the wafer and contacts a scribe line along its length. The compressive member may comprise a compliant material, as of urethane, having a uniform Shore A durometer of the order of 70-100 and uniform resiliency. In an alternative embodiment, the compressive member may comprise a compressive roller, also of urethane, having a similar uniform durometer.