Patents by Inventor William Beckenbaugh

William Beckenbaugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
    Patent number: 5429292
    Abstract: A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: July 4, 1995
    Assignee: Motorola, Inc.
    Inventors: Cynthia M. Melton, William Beckenbaugh, Dennis Miller
  • Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties
    Patent number: 5389160
    Abstract: A solder paste of the type utilized in forming a solder onnectin for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.
    Type: Grant
    Filed: June 1, 1993
    Date of Patent: February 14, 1995
    Assignee: Motorola, Inc.
    Inventors: Cynthia M. Melton, William Beckenbaugh, Dennis Miller
  • Palladium-coated solder ball
    Patent number: 5086966
    Abstract: A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon cooling, produces a strong metallurgical bond. In a preferred embodiment, lead-tin solder balls are pretreated by applying tin-palladium colloidal particles and dissociating the particles to form a discontinuous metallic palladium deposit.
    Type: Grant
    Filed: November 5, 1990
    Date of Patent: February 11, 1992
    Assignee: Motorola Inc.
    Inventors: Cynthia M. Melton, Carl J. Raleigh, Steven Scheifers, William Beckenbaugh