Abstract: There is disclosed a plating process that involves the application of a soft metallic coating, composed of substantially pure metal or alloy, to resilient metal seals utilizing a high-volume, high-energy electro-deposition plating process. The process basically includes supporting a predetermined quantity of metallic seals at non-sealing surface locations with the metallic seals disposed in series on a conveyor having a predetermined processing path, and continuously moving the seals in series through an electro-plating stage of the processing path to electro-deposit a metallic coating on the seals using a high current density and a high chemical flow rate. The seals of this process are applicable to any application or industry where a large quantity of high vacuum/high purity seals are required and where traditional electro-deposition processes would not yield a sufficient quantity of finished parts or would not produce them at an acceptable cost.