Abstract: Grounding a PCB to an enclosure sub-assembly is accomplished using a specially designed spring. The spring contains a base portion, an inclined portion and a head portion. Holes are provided in the base portion of the spring to allow for soldering to make a much stronger bond, reducing the chance of separation. A tab is provided on the top portion to reduce snagging nearby objects during installation. Notches are placed between the head portion and flaps connected to he head portion in order to reduce tearing that may occur during manufacture. The spring may then be used with a specially designed enclosure sub-assembly having a drawn feature, the drawn feature engaging the spring and compressing it, allowing grounding to occur. The drawn feature allows for the single spring design to be used in a wide variety of products.