Patents by Inventor William Blanton

William Blanton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • One-dimensional overlay marks
    Patent number: 12717246
    Abstract: Embodiments disclosed herein include semiconductor die with overlay marks, electronic devices that include semiconductor dies with overlay marks, and methods of measuring overlay. In one embodiment, a semiconductor die includes multiple overlay marks, including a first overlay mark and a second overlay mark. The first overlay mark is at a first position on the semiconductor die and includes a first set of patterns with a first orientation. The second overlay mark is at a second position on the semiconductor die and includes a second set of patterns with a second orientation. The first position of the first mark and the second position of the second mark are non-overlapping. In addition, the first orientation of the patterns in the first mark is substantially orthogonal to the second orientation of the patterns in the second mark.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: August 25, 2026
    Assignee: Intel Corporation
    Inventors: William Blanton, Deepak Selvanathan, Shakul Tandon, Martin N. Weiss
  • ONE-DIMENSIONAL OVERLAY MARKS
    Publication number: 20240004310
    Abstract: Embodiments disclosed herein include semiconductor die with overlay marks, electronic devices that include semiconductor dies with overlay marks, and methods of measuring overlay. In one embodiment, a semiconductor die includes multiple overlay marks, including a first overlay mark and a second overlay mark. The first overlay mark is at a first position on the semiconductor die and includes a first set of patterns with a first orientation. The second overlay mark is at a second position on the semiconductor die and includes a second set of patterns with a second orientation. The first position of the first mark and the second position of the second mark are non-overlapping. In addition, the first orientation of the patterns in the first mark is substantially orthogonal to the second orientation of the patterns in the second mark.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Applicant: Intel Corporation
    Inventors: William Blanton, Deepak Selvanathan, Shakul Tandon, Martin N. Weiss