Patents by Inventor William Blasius
William Blasius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12136774Abstract: An electromagnetic, EM, device, includes: a three-dimensional, 3D, body having a dielectric material, the 3D body having a first dielectric portion, 1DP, and a second dielectric portion, 2DP, wherein the 1DP is at least partially but not completely embedded within the 2DP; wherein the 1DP and the 2DP each have a dielectric material other than air; wherein the 1DP and the 2DP each have a planar cross-section profile perpendicular to a particular linear axis of the 3D body that is constant along the particular linear axis; wherein at least a portion of the 3D body is a dielectric resonator, DR.Type: GrantFiled: December 8, 2021Date of Patent: November 5, 2024Assignee: ROGERS CORPORATIONInventors: Jared K. Spink, William Blasius, Sergio Clavijo, Kristi Pance
-
Publication number: 20240355529Abstract: A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.Type: ApplicationFiled: April 22, 2024Publication date: October 24, 2024Inventors: Karl Sprentall, Vitali Judin, Rebecca Agapov, William Blasius, Nazeef Azam
-
Patent number: 12077658Abstract: A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.Type: GrantFiled: November 20, 2020Date of Patent: September 3, 2024Assignee: ROGERS CORPORATIONInventors: William Blasius, Stephen O'Connor
-
Publication number: 20230399237Abstract: In an aspect, a Co2Y-type ferrite includes oxides of at least Ba, La, Co, Me, Fe, and optionally Ca; wherein Me is at least Ni and optionally one or more of Zn, Cu, Mn, or Mg. A composite can include the Co2Y-type ferrite and a polymer. An article can include the Co2Y-type ferrite.Type: ApplicationFiled: June 2, 2023Publication date: December 14, 2023Inventors: Yajie Chen, Lance Young, Allen F. Horn, III, William Blasius, Lori Brock
-
Patent number: 11637377Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.Type: GrantFiled: November 22, 2019Date of Patent: April 25, 2023Assignee: ROGERS CORPORATIONInventors: Gianni Taraschi, Kristi Pance, Stephen O'Connor, Christopher Brown, Trevor Polidore, Allen F. Horn, III, Dirk Baars, Roshin Rose George, Jared Duperre, Shailesh Pandey, Karl E. Sprentall, Shawn P. Williams, William Blasius
-
Patent number: 11545753Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.Type: GrantFiled: December 6, 2021Date of Patent: January 3, 2023Assignee: ROGERS CORPORATIONInventors: Stephen O'Connor, Gianni Taraschi, Christopher Brown, Kristi Pance, Karl E. Sprentall, Bruce Fitts, Dirk Baars, William Blasius, Murali Sethumadhavan, Roshin Rose George, Michael S. White, Michael Lunt, Sam Henson, John Dobrick
-
Publication number: 20220356336Abstract: In an aspect, a thermoplastic composite comprises a polypropylene; a plurality of glass fibers; wherein the glass fibers comprise boric acid and CaO, both based on the total weight of the glass fibers; a plurality of clay platelets; and a plurality of clay rods; and wherein the thermoplastic composite comprises 0.5 to 10 weight percent of the of the sum of the plurality of clay platelets and the plurality of the clay nanorods based on the total weight of the thermoplastic composite. In another aspect, an article comprises an antenna array; a reflecting layer located on a surface of the antenna array; and a spacer layer comprising a thermoplastic component located in between the antenna array and the reflecting layer, wherein the thermoplastic composite comprises a thermoplastic polymer; a plurality of glass fibers; a plurality of clay platelets; and a plurality of clay rods.Type: ApplicationFiled: May 6, 2022Publication date: November 10, 2022Inventor: William Blasius
-
Publication number: 20220344827Abstract: In an aspect, a polarization converter comprises a plurality of alternating high Dk layers and low Dk layers that alternate along an x-direction; wherein neighboring broad surfaces of the respective high Dk layers and low Dk layers are bonded together. In another aspect, a polarization converter can comprise a plurality of alternating high Dk layers and low Dk layers that alternate along a radial direction; wherein neighboring broad surfaces of the respective high Dk layers and low Dk layers are bonded together. The polarization converter is capable of converting an incoming electromagnetic wave to an outgoing electromagnetic wave having a different polarization.Type: ApplicationFiled: April 25, 2022Publication date: October 27, 2022Inventors: Daniel Pennock, Sara G. Canzano, William Blasius, Shailesh Pandey, Kristi Pance, Gianni Taraschi
-
Publication number: 20220181783Abstract: An electromagnetic, EM, device, includes: a three-dimensional, 3D, body having a dielectric material, the 3D body having a first dielectric portion, 1DP, and a second dielectric portion, 2DP, wherein the 1DP is at least partially but not completely embedded within the 2DP; wherein the 1DP and the 2DP each have a dielectric material other than air; wherein the 1DP and the 2DP each have a planar cross-section profile perpendicular to a particular linear axis of the 3D body that is constant along the particular linear axis; wherein at least a portion of the 3D body is a dielectric resonator, DR.Type: ApplicationFiled: December 8, 2021Publication date: June 9, 2022Inventors: Jared K. Spink, William Blasius, Sergio Clavijo, Kristi Pance
-
Publication number: 20220158351Abstract: An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.Type: ApplicationFiled: December 6, 2021Publication date: May 19, 2022Inventors: Stephen O'Connor, Gianni Taraschi, Christopher Brown, Kristi Pance, Karl E. Sprentall, Bruce Fitts, Dirk Baars, William Blasius, Murali Sethumadhavan, Roshin Rose George, Michael S. White, Michael Lunt, Sam Henson, John Dobrick
-
Patent number: 11239563Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.Type: GrantFiled: April 29, 2019Date of Patent: February 1, 2022Assignee: ROGERS CORPORATIONInventors: Stephen O'Connor, Gianni Taraschi, Christopher Brown, Kristi Pance, Karl E. Sprentall, Bruce Fitts, Dirk Baars, William Blasius, Murali Sethumadhavan, Roshin Rose George, Michael S. White, Michael Lunt, Sam Henson, John Dobrick
-
Publication number: 20220029297Abstract: A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.Type: ApplicationFiled: November 22, 2019Publication date: January 27, 2022Inventors: Gianni Taraschi, Kristi Pance, Stephen O'Connor, Christopher Brown, Trevor Polidore, Allen F. Horn, III, Dirk Baars, Roshin Rose George, Jared Duperre, Shailesh Pandey, Karl E. Sprentall, Shawn P. Williams, William Blasius
-
Publication number: 20210155782Abstract: A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.Type: ApplicationFiled: November 20, 2020Publication date: May 27, 2021Inventors: William Blasius, Stephen O'Connor
-
Publication number: 20200369855Abstract: In an aspect, a composition comprises a hydrocarbyl thermoplastic polymer comprising repeat units derived from an alpha-olefin and a C4-30 cycloalkene; a reactive monomer which is free-radically crosslinkable to produce a crosslinked network; a free radical source; and a functionalized fused silica capable of chemically coupling to the crosslinked network.Type: ApplicationFiled: May 20, 2020Publication date: November 26, 2020Inventors: Thomas A. Koes, Nazeef Azam, Bryan Tworzydlo, Matthew Raymond Himes, William Blasius
-
Publication number: 20190341696Abstract: In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate.Type: ApplicationFiled: April 29, 2019Publication date: November 7, 2019Inventors: Stephen O'Connor, Gianni Taraschi, Christopher Brown, Kristi Pance, Karl E. Sprentall, Bruce Fitts, Dirk Baars, William Blasius, Murali Sethumadhavan, Roshin Rose George, Michael S. White, Michael Lunt, Sam Henson, John Dobrick