Abstract: A system for determining the attenuation of a light wave passing through a sampling volume, including a measurement part with an emission source emitting a collimated optical beam; a reference measurement channel measuring a reference optical intensity emitted by the emission source; a transmission measurement channel measuring a transmitted optical intensity in the sampling volume; a scattering measurement channel measuring a scattered optical intensity in the sampling volume; a guide assembly; and a control part controlling the measurement channels in order to carry out the transmission and scattering measurements concomitantly, and to determine the attenuation of the collimated optical beam in the sampling volume according to the reference optical intensity, the transmitted and scattered optical intensity, and the scattered optical intensity.

Abstract: A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

Abstract: A reflective member is formed and spaced from a provided partial reflective layer. The reflective member is movable relative to the partial reflective layer.

Abstract: A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Abstract: A MEMS package comprises a substrate and a cover plate. A MEMS structure is fabricated on a surface of the substrate. The cover plate may be bonded to the substrate by a bond ring. The cover plate, the bond ring and the substrate may define an inner cavity. The cover plate, the substrate and a breach in the bond ring may define a fill port.