Abstract: A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect.

Abstract: A commercial multiple barrel beer brewing apparatus includes a brew kettle at a first location; a hopped wort holding vessel; a chiller for chilling the hopped wort stored in the holding vessel to a temperature range of approximately 29° F. to 40° F.; a transportation vessel on a vehicle to transport chilled hopped wort to a brew pub; a first conduit between the chilled hopped wort holding vessel and the transportation vessel; a fermentation vessel located a brew pub; and a second conduit between the transportation vessel and the fermentation vessel.

Abstract: A method for distributed production of beer includes the steps of: producing multiple barrels of hopped wort in a brew kettle; chilling the hopped wort and transferring it to a transportation vessel on a vehicle; transporting the chilled hopped wort to a brew pub; transferring the hopped wort into a fermentation vessel at the brew pub; elevating the hopped wort to an appropriate fermentation temperature; and adding a predetermined amount of yeast cells to the hopped wort in the fermentation vessel to produce beer.

Abstract: An improved magnetic resonance (MR) imaging system (10) is provided. A plurality of receiver coils (12) may be configured to supply respective coil output signals based on a plurality of magnetic resonance response signals sensed by the receiver coils. Each receiver coil defines an enclosure constituting a Faraday cage. At least one circuit device (22) is disposed in the enclosure (24) to condition the coil output signal. This enclosure enables the circuit device (22) to be shielded from electromagnetic interference.

Abstract: One photodetection system includes a wide bandgap photodetector array which is physically and electrically integrated on a flexible interconnect layer including electrical connections, which is packaged in a manner for being electrically integrated with processing electronics such that the packaging and the processing electronics are configured for obtaining and processing signals detected by the photodetector array, or which includes both the flexible interconnect layer and processing electronics packaging features. Another photodetection system includes a wide bandgap focal plane array module including a photodetector pixel array, scan registers, a substrate supporting the array and the scan registers, and electrical interconnections coupling each pixel to at least two of the scan registers.

Abstract: A large area transducer array comprising a substrate having a front side and a backside, a plurality of transducers disposed on the front side of the substrate and patterned in the form of a two-dimensional transducer array in the X-Y plane, a plurality of connectors disposed on the backside of the substrate where the connectors are electrically coupled to the transducer elements. Further, a stacked transducer array comprising an electronic device disposed in a first layer, a substrate including a front side and a backside, an electrical interconnect layer disposed on the substrate and a plurality of transducers disposed in a third layer where the transducers are electrically coupled to the electronic device disposed in the first layer.

Abstract: A stacked electronics module comprises a first layer including a first substrate having a front side and a backside, a first electrical interconnect layer disposed on the first substrate and a first electronic device disposed on the front side of the first substrate. In addition, the stacked electronics module comprises a second layer including a second substrate having a front side and a backside, a second electrical interconnect layer disposed on the second substrate and a second electronic device disposed on the front side of the second substrate.

Abstract: An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.

Abstract: A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect. A detector for use in an imaging system comprises the aforementioned interconnect.

Abstract: A high density electrical interconnecting system of the present invention has at least one substrate piece and a flexible wrap-around interconnect assembly extending from a first surface of the substrate piece to a second surface of the substrate piece wherein the flexible wrap-around interconnect is disposed around an outer surface of the substrate piece.

Abstract: A detector module for use in an imaging system is provided. The detector comprises at least one sensor array configured for receiving X-ray signals and converting the X-ray signals to corresponding electrical signals, at least one electronic device configured for converting the electrical signals to a corresponding digital signal and a switching circuit coupling the sensor array and the electronic device, wherein the switching circuit is configured for routing the electrical signals from the sensor array to the electronic device.

Abstract: An imaging system for generating an image of an object is provided. The imaging system comprises an X-ray source disposed in a spatial relationship to the object configured to transmit X-ray radiation through the object. The system further comprises at least one X-ray detecting media configured to convert the X-ray radiation transmitted through the object to optical signals. In addition, the system comprises an optical transmission conduit comprising a first end and a second end and an optical detector configured to convert optical signals to corresponding electrical signals. The first end of the optical transmission conduit is coupled to the X-ray detection device and the second end coupled to the optical detector.

Abstract: A detector array kit that includes at least one sensor array. The sensor array has an active side at least one sensor on the flat active side configured to detect a particular form of energy. The sensor array active side has a positioning structure on the active side that is essentially transparent to the particular form of energy. The positioning structure includes a plurality of spaced compressible posts or tubes configured to compressively and frictionally engage with a complementary mounting structure. The detector kit further includes a complementary mounting structure essentially transparent to the particular form of energy.

Abstract: An integrated switch matrix for reconfiguring subelements of a mosaic sensor array to form elements. The configuration of the switch matrix is fully programmable. The switch matrix includes access switches that connect subelements to bus lines and matrix switches that connect subelements to subelements. Each subelement has a unit switch cell comprising at least one access switch, at least one matrix switch, a respective memory element for storing the future state of each switch, and a respective control circuit for each switch. The access and matrix switches are of a type having the ability to memorize control data representing the current switch state of the switch, which control data includes a data bit input to turn-on/off circuits incorporated in the control circuit. The sensor array and the switching matrix may be built in different strata of a co-integrated structure or they may be built on separate wafers that are electrically connected.

Abstract: The disclosed circuit determines whether a video signal is from a video tape player or a broadcast signal source by measuring jitter of the vertical synchronization pulses. In one embodiment, every other time interval between the vertical synchronization pulses is measured and saved as a count, and each count is compared to the preceding count to determine whether sufficient jitter is present to indicate that the video signal is from a local tape player. In another embodiment all intervals between the vertical synchronization pulses are measured and a predetermined number thereof are saved as counts. The even and odd counts are then analyzed separately, and the extreme count (the most deviant count) of each group is eliminated.