Abstract: In a gimbaled micromachined micromirror array optimized for parallel-plate electrostatic operation, longitudinal-type gimbal hinge elements are provided in which a plurality of torsional longitudinal hinge elements are arranged in an array parallel to the axis of rotation and which are linked together by rigid lateral brace sections. In primary embodiment the hinge elements are arranged in a double gimbal configuration. Specific embodiments of the hinge elements are simple longitudinal, compound longitudinal, stacked simple longitudinal, and stacked compound longitudinal. The longitudinal hinges may be used with various types of mirrors including circular or rectilinear, recessed or nonrecessed, where the hinges are connected in either a symmetric or asymmetric configuration relative to one another, as hereinafter illustrated by way of a subset of examples.

Abstract: A diffraction grating light valve modulates an incident beam of light. A plurality of elongated elements each have a reflective surface. The elongated elements are suspended with their respective ends substantially coplanar. Alternate ones of the elongated elements are electrically coupled for receiving a first bias voltage. The interdigitated elongated elements are electrically coupled for receiving a second bias voltage. By applying a appropriate first and second biasing voltages, all the reflective surfaces can be maintained in a first plane. When all the elongated elements are in the first plane, the diffraction grating light valve reflects the beam of light. A predetermined group of the elongated elements, preferably alternate ones, are deformable to be substantially coplanar in a second plane which is parallel to the first plane. When the predetermined group of elements is in the second plane, the diffraction grating light valve diffracts the beam of light.

Abstract: A deformable grating aparatus for modulating light is made by forming an insulating layer on a substrate, forming a first conductive layer on the insulating layer and then forming a sacrificial layer thereon. The sacrificial layer and the first conducting layer are then etched to define bit lines and busses to bonding pads. Then a layer of resilient material is formed onto the etched layers and a reflective conducting layer is formed on the resilient layer. A dielectric layer is deposited on the reflective conducting layer. The dielectric layer, the reflective conducting layer, the resilient layer and the sacrificial layer are all then etched to form a grating including a plurality of parallel elements. Thereafter the sacrificial layer is removed below the parallel elements, to suspend the parallel elements over the first conducting layer. The surface is treated to prevent the grating from adhering to the first conducting layer.