Patents by Inventor William C. Bond, Jr.

William C. Bond, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPDM interpolymers formed with unsaturated organosilanes
    Patent number: 4028483
    Abstract: An interpolymer of ethylene, a monoolefin containing from 3-20 carbon atoms, a polyene, and an unsaturated organosilane in which the interpolymer is prepared by interpolymerization reaction in the presence of a Ziegler type catalyst.
    Type: Grant
    Filed: September 8, 1975
    Date of Patent: June 7, 1977
    Assignee: Copolymer Rubber & Chemical Corporation
    Inventors: William C. Bond, Jr., Harold J. Wahlborg
  • Fulvene-silane adduct and ethylene interpolymers embodying same
    Patent number: 4022961
    Abstract: An adduct of a fulvene and unsaturated silane produced in a Diels-Alder reaction and the interpolymerization of the adduct with ethylene, with or without propylene, with or without a polyene, in the preparation of ethylene interpolymers.
    Type: Grant
    Filed: September 8, 1975
    Date of Patent: May 10, 1977
    Assignee: Copolymer Rubber & Chemical Corporation
    Inventors: William C. Bond, Jr., Harold J. Wahlborg
  • Fulvene-silane adduct and ethylene interpolymers embodying same
    Patent number: 3994947
    Abstract: An adduct of a fulvene and unsaturated silane produced in a Diels-Alder reaction and the interpolymerization of the adduct with ethylene, with or without propylene, with or without a polyene, in the preparation of ethylene interpolymers.
    Type: Grant
    Filed: February 10, 1975
    Date of Patent: November 30, 1976
    Assignee: Copolymer Rubber & Chemical Corporation
    Inventors: William C. Bond, Jr., Harold J. Wahlborg