Abstract: The present invention provides virtual mapping of system resource identifiers in use by a software application for the purpose of making the running state of an application node independent. By adding a layer of indirection between the application and the resource, new system resources are reallocated and then can be mapped to the application's existing resource requirements while it is running, without the application detecting a failure or change in resource handles. This layer of indirection makes the application's system resource identifier(system RID) transparent to the application. RID's are usually numeric in form, but can also be alphanumeric. RID's are unique to a machine, and can be reused once all claims to a specfic RID have been given up.

Abstract: The present invention provides virtual mapping of system resource identifiers in use by a software application for the purpose of making the running state of an application node independent. By adding a layer of indirection between the application and the resource, new system resources are reallocated and then can be mapped to the application's existing resource requirements while it is running, without the application detecting a failure or change in resource handles. This layer of indirection makes the application's system resource identifier (system RID) transparent to the application. RID's are usually numeric in form, but can also be alphanumeric. RID's are unique to a machine, and can be reused once all claims to a specific RID have been given up.

Abstract: A semiconductor device having a heat spreading layer (18,118) of material deposited by flame spraying on a back surface of the semiconductor die (12,112). The semiconductor die (12,112) has a thermal coefficient of expansion substantially similar to the thermal coefficient of expansion of the flame sprayed material. The flame sprayed material may be deposited directly on the semiconductor die (12,112) or on a backmetal layer (15). The heat spreading layer (18,118) is suitable for affixing the semiconductor die (12,112) to a metal substrate (27,127).

Abstract: A cellular motor control network including a service center and a plurality of local cell controllers in communication with the service center, with each of the plurality of local cell controllers having a plurality of cellular motor controls in communication therewith. Each cellular motor control coupled to a variable speed electric motor. The cellular motor control including control circuits for controlling the operation of the variable speed electric motor, a microprocessor coupled to the control circuits for providing a predetermined control program, and a transceiver coupled to the microprocessor for communicating information between the microprocessor and other control units in the network.