Abstract: The present Invention relates to the use of a compound in a lubricating composition as an engine oil antiwear and/or extreme pressure agent, wherein the compound is a heterocycle having a hydrocarbyl group containing 6 to 40 carbon atoms, wherein the heterocycle is either (i) a heterocycle compound having a functional group selected from the group consisting of at least one of an ester, an amide, a salt and an acid, or (ii) a pyrimidine.

Abstract: The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

Abstract: The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

Abstract: The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

Abstract: The present Invention relates to the use of a compound in a lubricating composition as an engine oil antiwear and/or extreme pressure agent, wherein the compound is a heterocycle having a hydrocarbyl group containing 6 to 40 carbon atoms, wherein the heterocycle is either (i) a heterocycle compound having a functional group selected from the group consisting of at least one of an ester, an amide, a salt and an acid, or (ii) a pyrimidine.

Abstract: The present invention relates to a lubricating composition containing an alkali metal borate. The invention further provides for a method of lubricating a device with grease or a metalworking fluid by employing the lubricating composition containing the alkali metal borate.

Abstract: The invention relates to an industrial gear formulation containing a high TBN overbased detergent that results in decreasing micropitting for industrial gears.

Abstract: A free-piston device has a stabilized piston drift. A piston having a frequency of reciprocation over a stroke length and with first and second sides facing first and second variable volumes, respectively, for containing a working fluid defining an acoustic wavelength at the frequency of reciprocation. A bypass tube waveguide connects the first and second variable volumes at all times during reciprocation of the piston. The waveguide has a relatively low impedance for steady flow and a relatively high impedance for oscillating flow at the frequency of reciprocation of the piston, so that steady flow returns fluid leakage from about the piston between the first and second volumes while oscillating flow is not diverted through the waveguide. Thus, net leakage about the piston is returned during each stroke of the piston while oscillating leakage is not allowed and pressure buildup on either the first or second side of the piston is avoided to provide a stable piston location.

Abstract: Continuously variable transmission can be lubricated by supplying to them a composition of (a) an oil of lubricating viscosity; (b) a dispersant; and (c) a detergent. At least one of the dispersant (b) and the detergent (c) is a borated species, and the amount of boron present in the composition is sufficient to impart improved friction and anti-seizure properties to the composition when employed in said transmission.

Abstract: Energy transfer apparatus has a resonator for supporting standing acoustic waves at a selected frequency with a steady flow process fluid thermodynamic medium and a solid medium having heat capacity. The fluid medium and the solid medium are disposed within the resonator for thermal contact therebetween and for relative motion therebetween. The relative motion is produced by a first means for producing a steady velocity component and second means for producing an oscillating velocity component at the selected frequency and concomitant wavelength of the standing acoustic wave. The oscillating velocity and associated oscillating pressure component provide energy transfer between the steady flow process fluid and the solid medium as the steady flow process fluid moves through the resonator.

Abstract: A composition for use in lubricants and function fluids to provide improved anti-shudder and shudder durability properties to an automatic transmission. The composition comprises alkoxylated fatty amines as well as a mixture of other friction modifiers.

Abstract: This is a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additional contacts between each wire and its respective lead even if the bonded contact breaks or fails at or immediately adjacent to the bonding point. This is accomplished by placing an insulating layer on the active surface of each chip, carrying input and output bonding pads thereon, to which lead frame conductors have been connected by bonding wires.

Abstract: A method of making a semiconductor chip in which the conductive path between the chip and the lead frame via wires can be easily and reproduceably improved. This is accomplished by improving the bond between the wires and the lead frame members to which the wires are joined and by creating additional contacts between each wire and its respective lead even if the bonded contact breaks or fails at or immediately adjacent to the bonding point. This is accomplished by placing an insulating layer on the active surface of each chip, carrying input and output bonding pads thereon, to which lead frame conductors have been connected by bonding wires.

Abstract: A plastic encapsulated semiconductor package in which the connecting lead frame members are deposited over the surface of the device together with a covering ground plane so as to provide enhanced electrical and thermal coupling of the members and the device and so reduce the signal to noise ratio by a factor or greater than three over that available in other similar plastic encapsulated packages while simultaneously improving the transfer of heat out of the package.In particular, a lead frame having a plurality of conductors is attached to a major active surface of a semiconductor chip via a ground plane which, in the preferred embodiment, is a multilayered structure containing an insulated integral, uniform ground plane positioned between the lead frame and the chip and adhesively and insulatively joined to both of them. Wires connect terminals on the major active surface of the semiconductor chip to the ground plane and to selective lead frame conductors.

Abstract: In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.

Abstract: A compression bond is formed between a gold or gold alloy wire and lead/tin solder by forming a head on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/tin intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.

Abstract: A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An external heat sink is mounted onto the plastic body. A clip or through bolt establishes thermal contact between the external heat sink and the internal thermally conductive strip.

Abstract: The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably by means of an alpha barrier. The conductors cover a substantial portion of the surface of the chip and thereby serve as conduits for the dissipation of heat from the chip. Wires are bonded to the conductors and extend from the conductors to the terminals on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals are located along a center line of the chip. This allows for short connecting wires which in turn contribute to faster chip response.

Abstract: An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.

Abstract: An improved thermal management technique is disclosed for use in semiconductor device packaging utilizing ultrasonic welding to attach aluminum wires of predetermined diameter at one end directly to preselected hot spots on the device and at the other end to thermally conductive package elements.