Patents by Inventor William C. Wilkinson

William C. Wilkinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for optimizing fit of an implant to anatomy
    Patent number: 11977817
    Abstract: A system and method for pre-operatively optimizing a fit of an orthopaedic implant relative to a particular individuals anatomy is provided.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: May 7, 2024
    Assignee: SMITH & NEPHEW, INC.
    Inventors: Brian W. McKinnon, Ruxandra C. Marinescu Tanasoca, Randy C. Winebarger, William L. Bowers, Jr., James B. Wiebe, III, Nathaniel M. Lenz, Zachary C. Wilkinson, Sean M. Haddock, Ryan L Landon
  • Thermally conductive printed wiring board laminate
    Patent number: 4609586
    Abstract: A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/.degree.C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/.degree.C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.
    Type: Grant
    Filed: August 2, 1984
    Date of Patent: September 2, 1986
    Assignee: The Boeing Company
    Inventors: Warren M. Jensen, William C. Wilkinson