Abstract: Systems and methods for optimizing parameters of an orthopaedic procedure for a particular patient, including parameters relating to the anatomic and biomechanic fit of an implant or implant system implanted into the patient's joint. These systems and methods may utilize patient-specific information gathered pre-operatively in conjunction with optimization algorithms to determine an optimal implant design and an optimal position and orientation for implantation of the implant into the particular patient's joint.

Abstract: A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/.degree.C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/.degree.C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.