Abstract: A printed wiring board laminate is disclosed that is particularly suitable for use with leadless surface mounted devices such as ceramic chip carries. The laminate combines a low coefficient of thermal expansion in the X-Y direction with thermal conductivity. In one embodiment, the laminate comprises a support fabricated from graphite fiber reinforced metal adhesively secured to a printed wiring board fabricated from dielectric (e.g., glass) fiber reinforced resin. The support has an X-Y coefficient of thermal expansion less than about 4 ppm/.degree.C., and the printed wiring board has a coefficient of thermal expansion greater than about 10 ppm/.degree.C. In a second embodiment, the support comprises a core of graphite fiber reinforced metal or resin sandwiched between two metal sheets.