Patents by Inventor William Candy

William Candy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Board-level EMI shield with enhanced thermal dissipation
    Patent number: 6744640
    Abstract: A substrate having at least one electrical component disposed thereon; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer; a plurality of apertures formed in the board-level EMI shield such that the apertures correspond to the pattern of the electrically conductive fastening units; with at least one thermally conductive interface (TCI) material disposed over the at least one electrical component; and wherein the electrically conductive layer of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit.
    Type: Grant
    Filed: April 10, 2002
    Date of Patent: June 1, 2004
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Bradley Reis, William Candy
  • Board-level EMI shield with enhanced thermal dissipation
    Publication number: 20030193794
    Abstract: A substrate having at least one electrical component disposed thereon; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer; a plurality of apertures formed in the board-level EMI shield such that the apertures correspond to the pattern of the electrically conductive fastening units; with at least one thermally conductive interface (TCI) material disposed over the at least one electrical component; and wherein the electrically conductive layer of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 16, 2003
    Inventors: Bradley Reis, William Candy
  • Padded liner
    Patent number: D840026
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: February 5, 2019
    Assignee: AquaCast Liner LLC
    Inventor: William Candy
  • Extended liner
    Patent number: D841799
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: February 26, 2019
    Assignee: AquaCast Liner LLC
    Inventor: William Candy