Abstract: A method includes obtaining a base structure including a stack of dielectric layers disposed on a substrate. The stack of dielectric layers includes a first photosensitive dielectric layer including a first photosensitive dielectric material sensitive to a first radiation dose, a second photosensitive dielectric layer including a second photosensitive dielectric material sensitive to a second radiation dose different from the first radiation dose, and a barrier layer disposed between the first photosensitive dielectric layer and the second photosensitive dielectric layer. The method further includes forming a dual damascene structure from the base structure using a dual damascene process.

Abstract: There is set forth herein according to one embodiment an optoelectrical system comprising a first photonics structure having a first photonics dielectric stack; and a second photonics structure having a second photonics dielectric stack.

Abstract: There is set forth herein a method including building a first photonics structure using, wherein the building the first photonics structure includes fabricating one or more photonics device.

Abstract: A method includes obtaining a base structure including a stack of dielectric layers disposed on a substrate. The stack of dielectric layers includes a first photosensitive dielectric layer including a first photosensitive dielectric material sensitive to a first radiation dose, a second photosensitive dielectric layer including a second photosensitive dielectric material sensitive to a second radiation dose different from the first radiation dose, and a barrier layer disposed between the first photosensitive dielectric layer and the second photosensitive dielectric layer. The method further includes forming a dual damascene structure from the base structure using a dual damascene process.

Abstract: A cutting board with one or more cut-out sections is provided. The cutting board includes at least one work surface and a frame that transitions from a first (e.g., closed, stowed) position to a second position in which the frame at least partially defines a cut-out for removably holding one or more containers. The work surface may be used to prepare food ingredients, which are easily transported to the one or more containers. When work is complete, the containers are removed and the frame is returned to the first position, in which the cutting board occupies less space than in the second position.

Abstract: A cutting board with one or more cut-out sections is provided. The cutting board includes at least one work surface and a frame that transitions from a first (e.g., closed, stowed) position to a second position in which the frame at least partially defines a cut-out for removably holding one or more containers. The work surface may be used to prepare food ingredients, which are easily transported to the one or more containers. When work is complete, the containers are removed and the frame is returned to the first position, in which the cutting board occupies less space than in the second position.

Abstract: Nestable containers are provided for installation within a compatible cutting board or for stand-alone use. A first container features a lip along at least part of a circumference of the container, and a ledge below the lip that also extends along at least part of the circumference. A second container features a cooperative lip that, when the second container is nested within the first container, engages or rests upon the ledge of the first container. The lips and/or the ledge may be continuous or discontinuous.

Abstract: A cutting board with one or more cut-out sections is provided. Each cut-out is defined by a ledge, and one or more containers may be installed in a cut-out, by engaging their rims/edges with a cut-out ledge. After installation, and during use of the cutting board, no container extends above a work surface of the cutting board. Therefore, food ingredients, remnants, scraps, and so on can be easily and directly scraped or otherwise moved from the work surface to the installed containers. A portion of the cutting board that comprises the work surface is placed on a counter or other support and may be weighted to offset the weight of the containers, which overlie open space or an area lower than the counter (e.g., a sink).

Abstract: There is set forth herein a method including building a first photonics structure using, wherein the building the first photonics structure includes fabricating one or more photonics device.

Abstract: A cutting board with one or more cut-out sections is provided. Each cut-out is defined by a ledge, and one or more containers may be installed in a cut-out, by engaging their rims/edges with a cut-out ledge. After installation, and during use of the cutting board, no container extends above a work surface of the cutting board. Therefore, food ingredients, remnants, scraps, and so on can be easily and directly scraped or otherwise moved from the work surface to the installed containers. A portion of the cutting board that comprises the work surface is placed on a counter or other support and may be weighted to offset the weight of the containers, which overlie open space or an area lower than the counter (e.g., a sink).

Abstract: A cutting board with one or more cut-out sections is provided. Each cut-out is defined by a ledge, and one or more containers may be installed in a cut-out, by engaging their rims/edges with a cut-out ledge. After installation, and during use of the cutting board, no container extends above a work surface of the cutting board. Therefore, food ingredients, remnants, scraps, and so on can be easily and directly scraped or otherwise moved from the work surface to the installed containers. A portion of the cutting board that comprises the work surface is placed on a counter or other support and may be weighted to offset the weight of the containers, which overlie open space or an area lower than the counter (e.g., a sink).

Abstract: There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.

Abstract: A cutting board with one or more cut-out sections is provided. The cutting board includes at least one work surface and a frame that transitions from a first (e.g., closed, stowed) position to a second position in which the frame at least partially defines a cut-out for removably holding one or more containers. The work surface may be used to prepare food ingredients, which are easily transported to the one or more containers. When work is complete, the containers are removed and the frame is returned to the first position, in which the cutting board occupies less space than in the second position.

Abstract: There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.

Abstract: A cutting board with one or more cut-out sections is provided. Each cut-out is defined by a ledge, and one or more containers may be installed in a cut-out, by engaging their rims/edges with a cut-out ledge. After installation, and during use of the cutting board, no container extends above a work surface of the cutting board. Therefore, food ingredients, remnants, scraps, and so on can be easily and directly scraped or otherwise moved from the work surface to the installed containers. A portion of the cutting board that comprises the work surface is placed on a counter or other support and may be weighted to offset the weight of the containers, which overlie open space or an area lower than the counter (e.g., a sink).

Abstract: There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.

Abstract: There is set forth herein a method including a substrate; a dielectric stack disposed on the substrate; one or more photonics device integrated in the dielectric stack; and a laser light source having a laser stack including a plurality of structures arranged in a stack, wherein structures of the plurality of structures are integrated in the dielectric stack, wherein the laser stack includes an active region configured to emit light in response to the application of electrical energy to the laser stack.

Abstract: A method for forming a ceramic object from a ceramic powder is provided. The ceramic powder is placed in a press. Pressure is applied to the ceramic powder with a pressure to cause consolidation of the ceramic powder. Ultrasonic energy is applied to the ceramic powder for at least a period of time during the applying pressure to the ceramic powder, forming the ceramic powder into a ceramic object. The applying pressure to the ceramic powder is ended.

Abstract: A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.

Abstract: A method of forming a dense oxide coating on an aluminum component of semiconductor processing equipment comprises cold spraying a layer of pure aluminum on a surface of the aluminum component to a predetermined thickness. A dense oxide coating is then formed on the layer of pure aluminum using a plasma electrolytic oxidation process, wherein the plasma electrolytic oxidation process causes the layer of pure aluminum to undergo microplasmic discharges, thus forming the dense oxide coating on the layer of pure aluminum on the surface of the aluminum component.