Abstract: The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes.

Abstract: The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities during plating of aluminum on substrates. The higher current density plating creates aluminum films with grain structures that are different from conventional plated aluminum films. In some embodiments, the average grain sizes are smaller in the hard aluminum films than conventional plated aluminum films. In some embodiments, the plated aluminum layer is anodized. In some embodiments, a multi-layered aluminum coating is formed using a combination of high current density and low current density plating. In some embodiments, a current filter is used to provide uniform plating across a part.

Abstract: The described embodiments relate generally to aluminum layer and methods for forming aluminum layer onto metal substrates. Methods involve increasing the hardness of the aluminum layers by embedding hardening particles therein. According to some embodiments, hardening particles are co-deposited with aluminum onto a substrate using an electroplating process. The electrolytic process involves using an electrolytic bath having the hardening particles dispersed therein. The hardening particles can form a supportive network within the aluminum layer that increases the hardness of the aluminum layer. In some embodiments, a portion of the aluminum layer is converted to aluminum oxide.

Abstract: The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities during plating of aluminum on substrates. The higher current density plating creates aluminum films with grain structures that are different from conventional plated aluminum films. In some embodiments, the average grain sizes are smaller in the hard aluminum films than conventional plated aluminum films. In some embodiments, the plated aluminum layer is anodized. In some embodiments, a multi-layered aluminum coating is formed using a combination of high current density and low current density plating. In some embodiments, a current filter is used to provide uniform plating across a part.

Abstract: The described embodiments relate generally to aluminum films and pretreatments for improving the adhesion of aluminum films on substrate surfaces. Methods involve providing three-dimensional adhesion surfaces on the substrate that promote adhesion to a subsequently deposited aluminum film. The methods can avoid the use of strike materials, such as nickel and copper, used in conventional adhesion-promoting treatments. According to some embodiments, methods involve providing an aluminum oxide adhesion layer on the substrate prior to depositing aluminum. According to some embodiments, methods involve providing a zincating layer on the substrate prior to depositing aluminum. According some embodiments, methods involve roughening the surface of the substrate prior to depositing aluminum. Some embodiments involve a combination of two or more substrate pretreatments. Described methods can be used to provide more flexibility in subsequent anodizing processes.