Patents by Inventor William Chau

William Chau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11922470
    Abstract: Impact-based strength and weakness determination includes receiving a plurality of industry-wide feedback items, the industry-wide feedback items pertaining to a plurality of entities associated with an industry. It further includes, based at least in part on an evaluation of the plurality of industry-wide feedback items, generating an industry-wide reputation scoring model usable to determine an expected reputation score for a typical entity in the industry based at least in part on a combination of one or more reputation score components. Generating the industry-wide reputation scoring model comprises determining (1) a baseline reputation score, and (2) an expected impact of a reputation score component on reputation scoring for the typical entity in the industry.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: March 5, 2024
    Assignee: Reputation.com, Inc.
    Inventors: Bradley William Null, Pranav Desai, Hsin-wei Tsao, Chun Fai Chau
  • Patent number: 9575124
    Abstract: A system for communicating high voltages for a semiconductor device is provided. One system includes a controller having an input pad and an output pad, each of the input pad and the output pad being coupled to a respective high voltage switch of the controller. The system also includes a plurality of semiconductor chips, where each of the plurality of semiconductor chips has at least one input pad coupled to a high voltage switch of a respective semiconductor chip. A high voltage that is higher than normal operation voltages of the semiconductor device is coupled from the input pad of the controller to the output pad of the controller via the coupled high voltage switches of the controller. The high voltage is further coupled from the output pad of the controller to the at least one input pad of the respective semiconductor chip via the high voltage switch coupled to the at least one input pad of the respective semiconductor chip.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: February 21, 2017
    Assignee: SanDisk Technologies LLC
    Inventors: Darmin Jin, William Chau, Brian Cheung
  • Publication number: 20150054565
    Abstract: A system for communicating high voltages for a semiconductor device is provided. One system includes a controller having an input pad and an output pad, each of the input pad and the output pad being coupled to a respective high voltage switch of the controller. The system also includes a plurality of semiconductor chips, where each of the plurality of semiconductor chips has at least one input pad coupled to a high voltage switch of a respective semiconductor chip. A high voltage that is higher than normal operation voltages of the semiconductor device is coupled from the input pad of the controller to the output pad of the controller via the coupled high voltage switches of the controller. The high voltage is further coupled from the output pad of the controller to the at least one input pad of the respective semiconductor chip via the high voltage switch coupled to the at least one input pad of the respective semiconductor chip.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 26, 2015
    Inventors: Darmin Jin, William Chau, Brian Cheung
  • Patent number: 8884679
    Abstract: Apparatus and method for coupling high voltages for a semiconductor device via high voltage switches are disclosed. A high voltage switch includes a switch and a level shifter. The switch is defined between a voltage source and a voltage output. An enable line is coupled to a first transistor of the switch. The level shifter includes an input and an output. A characterization line is coupled to the input of the level shifter and the output of the level shifter is coupled to a second transistor of the switch. The level shifter further includes a power rail that is coupled to the switch between the first transistor and the second transistor.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: November 11, 2014
    Assignee: Sandisk Technologies Inc.
    Inventors: Darmin Jin, William Chau, Brian Cheung
  • Publication number: 20130300485
    Abstract: Apparatus and method for coupling high voltages for a semiconductor device via high voltage switches are disclosed. A high voltage switch includes a switch and a level shifter. The switch is defined between a voltage source and a voltage output. An enable line is coupled to a first transistor of the switch. The level shifter includes an input and an output. A characterization line is coupled to the input of the level shifter and the output of the level shifter is coupled to a second transistor of the switch. The level shifter further includes a power rail that is coupled to the switch between the first transistor and the second transistor.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Applicant: SANDISK TECHNOLOGIES INC.
    Inventors: Darmin Jin, William Chau, Brian Cheung
  • Patent number: 5778182
    Abstract: A usage management system for tracking usage of applications available to subscribers of an interactive network includes an application server adapted to process a plurality of applications on demand by the users. The application server generates a plurality of event records each event record including at least one active domain identifier representing a domain being executed. Each domain represents an executable logical location within an application. A usage processing server is coupled to the application server, which is adapted to receive signals from the application server corresponding to the generated event records. The usage processing server is further adapted to track the time of occurrence of each domain identified in each event record.
    Type: Grant
    Filed: November 7, 1995
    Date of Patent: July 7, 1998
    Assignee: AT&T Corp.
    Inventors: Deborah Ann Cathey, William Chau, Krishna Ramachandran Mathis, Paul Nema, Jonathan Yang