Patents by Inventor William Connell

William Connell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980580
    Abstract: A patient support may be adjustable in height, width, length or a combination thereof. The patient support may be usable with normal sized patients or with bariatric patients. The patient support has a variety of features to enhance operability and/or functionality, including a width adjustable caster frame, width adjustable deck portions, a width adjustable headboard and an extendible foot board to provide extra length. An enhanced lift mechanism can accommodate bariatric patients and alternative functionality in achieving deck positions improves patient comfort. Various parts of the patient support including deck panels and the footboard may be removed and replaced with ease without complicated connectors.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: May 14, 2024
    Assignee: Stryker Corporation
    Inventors: Richard Brian Roussy, Jason John Connell, Joseph Steven David Elku, Jason James Cerny, Christopher Alan George, Joseph William Roussy, Christopher Scott Jacob, Aleem Yusuf
  • Publication number: 20210276647
    Abstract: A ski assembly for a bicycle includes a mounting frame with a mounting aperture therein and a wheel axle that is received through the mounting aperture of the mounting frame and extends through one of the wheels of the bicycle to mount the wheel relative to the bicycle while supporting the mounting frame in part relative to the bicycle. Two ski members are pivotally supported on respective support arms that are movable relative to the mounting frame by a biasing member that urges the ski member downwardly. The biasing member can be adjusted relative to the mounting frame between a working position in which the ski members are arranged to engage the ground at opposing sides of the wheel of the bicycle and a stored position in which the ski members are supported in raised elevation and out-of-use relative to the working position.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 9, 2021
    Inventors: William Connell Nicoll, Zach Larson
  • Publication number: 20150220506
    Abstract: A system for communicating document annotations includes a host computing platform having a first processor and a transmitter for transmitting information. The system further includes a head mounted display device having a second processor, a micro-display driven by the second processor and a receiver for receiving information from the remote host. The information from the remote host includes information representative of a document and information representative of one or more annotations. The second processor combines the information representative of a document with the information representative of one or more annotations to produce an annotated document, and displays the annotated document on the micro-display.
    Type: Application
    Filed: February 5, 2015
    Publication date: August 6, 2015
    Inventors: Christopher Parkinson, Jeffrey J. Jacobsen, Luke Hopkins, James Woodall, William Connell
  • Patent number: 7786486
    Abstract: An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically-insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally-conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: August 31, 2010
    Assignee: Satcon Technology Corporation
    Inventors: Leo Francis Casey, Bogdan Szczepan Borowy, Gregg Herbert Davis, James William Connell, III
  • Publication number: 20070057284
    Abstract: An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically-insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally-conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.
    Type: Application
    Filed: August 2, 2006
    Publication date: March 15, 2007
    Inventors: Leo Francis Casey, Bogdan Szczepan Borowy, Gregg Herbert Davis, James William Connell