Abstract: A method for decoding a memory array address for an embedded DRAM (eDRAM) device is disclosed, the eDRAM device being configured for operation with an SDRAM memory manager. In an exemplary embodiment of the invention, the method includes receiving a set of row address bits from the memory manager at a first time. A set of initial column address bits is then subsequently from the memory manager at a later time. The set of initial column address bits are translated to a set of translated column address bits, and the set of row address bits and the set of translated column address bits are simultaneously used to access a desired memory location in the eDRAM device. The desired memory location in the eDRAM device has a row address corresponding to the value of the set of row address bits and a column address corresponding to the value of the set of translated column address bits.

Abstract: A thermal conductive tape article is provided which is adhered to the surface of an integrated circuit device to dissipate heat from the device. The thermal conductive tape article is preferably corrugated and may have a number of configurations providing an expanded surface area. The corrugated tape article may also have a metal strip bonded to one or both sides of the tape article to form a single-faced or double-faced corrugated tape article. The tape article is preferably made of copper or aluminum.