Patents by Inventor William D. Brewer

William D. Brewer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electro-optical connectors
    Patent number: 5093879
    Abstract: A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc.
    Type: Grant
    Filed: June 22, 1990
    Date of Patent: March 3, 1992
    Assignee: International Business Machines Corporation
    Inventors: Mark F. Bregman, William D. Brewer, Mitchell S. Cohen, Glen W. Johnson, Ismail C. Noyan, Modest M. Oprysko, Mark B. Ritter, Dennis L. Rogers, Jeanine M. Trewhella
  • Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
    Patent number: 5074969
    Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
    Type: Grant
    Filed: March 7, 1991
    Date of Patent: December 24, 1991
    Assignee: IBM Corporation
    Inventors: William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer, Sampath Purushothaman, David L. Rath
  • Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
    Patent number: 5038195
    Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
    Type: Grant
    Filed: February 9, 1990
    Date of Patent: August 6, 1991
    Assignee: IBM
    Inventors: William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer, Sampath Purushothaman, David L. Rath
  • Method of manufacturing laminated foam plastics materials
    Patent number: 4540455
    Abstract: A method of manufacturing laminated plastics materials comprising passing a first sheet material adjacent a barrier in parallel spaced relation to the barrier which is disposed obliquely to the direction of passage of the first sheet material and applying a quantity of unfoamed polyurethane prepolymer at or adjacent the edge of the first sheet upstream of the most upstream part of the barrier. A second sheet material may be applied to the foam as it passes under the barrier.
    Type: Grant
    Filed: March 23, 1984
    Date of Patent: September 10, 1985
    Inventor: William D. Brewer