Abstract: In some embodiments, the present disclosure relates to a system. The system includes a substrate and a fluid capture material formed on one or more surfaces of the substrate. The fluid capture material includes a sorbent material that binds one or more fluids, the one or more fluids comprising water, carbon dioxide, sulfur oxides, or a combination thereof. The fluid capture material also includes one or more binder materials, wherein the binder material is at least partially cross-linked.

Abstract: In order to obtain shorter exposure time and to obtain a longer life in x-ray lithography apparatus, an x-ray target made of tungsten is utilized and the apparatus operated to generate the tungsten M-line, this line being at a wavelength which will be absorbed by the resist normally used in lithography. To develop the resist, which was initially designed for use in an electron beam lithography, a developing method is used in which an initial short development with a high concentration is first carried out followed by a longer, full development with a concentration which is approximately the lowest at which complete development will take place.

Abstract: In order to obtain shorter exposure time and to obtain a longer life in x-ray lithography apparatus, an x-ray target made of tungsten is utilized and the apparatus operated to generate the tungsten M-line, this line being at a wavelength which will be absorbed by the resist normally used in lithography. To develop the resist, which was initially designed for use in an electron beam lithography, a developing method is used in which a initial short development with a high concentration is first carried out followed by a longer, full development with a concentration which is approximately the lowest at which complete development will take place.

Abstract: In order to make a mask for use in lithography a layer of reflective material is first deposited on a substrate which is transparent to the radiation with which the mask is to be used; a layer of photoresist then deposited; the photoresist exposed with the desired pattern by UV radiation; the photoresist developed to expose the reflective material in the areas where it is desired to deposit an absorber material; the reflective material etched away from these areas undercutting the resist; the absorber deposited through the openings in the resist and reflective layer and the resist then lifted off.

Abstract: In order to obtain shorter exposure time and to obtain a longer life in x-ray lithography apparatus, an x-ray target made of tungsten is utilized and the apparatus operated to generate the tungsten M-line, this line being at a wavelength which will be absorbed by the resist normally used in lithography. To develop the resist, which was initially designed for use in an electron beam lithography, a developing method is used in which a initial short development with a high concentration is first carried out followed by a longer, full development with a concentration which is approximately the lowest at which complete development will take place.

Abstract: An improved memory device to be used in a D.C. circuit which device includes a pair of spaced electrodes between which extends a body of a generally amorphous high resistance memory semiconductor material made of a composition of at least two elements and wherein the application to the electrodes of one or more set voltage pulses in excess of a given threshold level produces a relatively low resistance filamentous path comprising a deposit of at least one of said elements in a crystalline or relatively ordered state. When one or more D.C. current reset pulses of a given value and duration are fed through the filamentous path, the crystalline deposit is returned to a relatively disordered state and the more electropositive element of said composition normally tends to migrate to the negative electrode and the more electronegative element thereof normally tends to migrate to the positive electrode.