Patents by Inventor William D. McWhorter

William D. McWhorter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10393618
    Abstract: Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: August 27, 2019
    Assignee: NXP USA, Inc.
    Inventors: Peter T. Jones, Arvind Salian, William D. McWhorter, Chad Krueger, John Shipman, Michael Naumann, Larry D. Metzler, Tripti Regmi
  • Publication number: 20170370799
    Abstract: Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.
    Type: Application
    Filed: June 22, 2016
    Publication date: December 28, 2017
    Applicant: FREESCALE SEMICONDUCTOR INC.
    Inventors: PETER T. JONES, ARVIND SALIAN, WILLIAM D. MCWHORTER, CHAD KRUEGER, JOHN SHIPMAN, MICHAEL NAUMANN, LARRY D. METZLER, TRIPTI REGMI
  • Patent number: 9543067
    Abstract: Methods, systems and apparatus are provided to apply a magnetic pre-conditioning to magnetic tunneling junction (MTJ) sensors and other micro-magnetic devices after fabrication but before testing, trimming or other subsequent processing. The fabricated sensor device is passed through a magnetic field that has a known direction and orientation relative to the device so that the device is placed into a known state prior to final testing and trimming. Various embodiments allow the field to be applied in situ by a permanent magnet or electromagnet as the devices are being processed by a conventional device handler or similar processing system.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: January 10, 2017
    Assignee: NXP USA, INC.
    Inventors: Carlos M. Acuna, Mohammad A. Faruque, Kevin R. Fugate, Todd D. Hoffmann, Paige M. Holm, Peter T. Jones, Rigoberto Lopez, Jr., William D. McWhorter
  • Patent number: 9527731
    Abstract: A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: December 27, 2016
    Assignee: NXP USA, Inc.
    Inventors: Bruno J. Debeurre, Peter T. Jones, William D. McWhorter, Raimondo P. Sessego
  • Patent number: 9400226
    Abstract: Embodiments of systems for calibrating transducer-including devices include a board support structure, one or more motors, a motor control module, and a calibration control module. The board support structure holds a calibration board in a fixed position with respect to the board support structure. The motor(s) rotate the board support structure around one or more axes of a fixed coordinate system. The motor control module sends motor control signals to the motor(s) to cause the motor(s) to move the board support structure through a series of orientations with respect to the fixed coordinate system. The calibration control module sends, through a communication structure, signals to the transducer-including devices, which are loaded into a plurality of sockets of the calibration board. The signals cause the transducer-including devices to generate transducer data while the board support structure is in or moving toward each orientation of the series of orientations.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: July 26, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Raimondo P. Sessego, Peter T. Jones, Seyed K. Paransun, James D. Stanley, William D. McWhorter
  • Publication number: 20160116361
    Abstract: A system for testing pressure sensors on a device wafer includes a tray for holding the device wafer. The tray includes a base having a surface, a spacer extending from the surface, and a tacky material disposed on the surface. The spacer holds the device wafer spaced apart from the surface of the base to form a chamber between the surface and the device wafer. A wafer chuck retains the tray and the device wafer under vacuum. The system further includes a nozzle and a seal element in fixed engagement with the nozzle. The seal element surrounds the outlet of the nozzle and is adapted for mechanical contact with the device wafer. An actuator is configured to place the nozzle and a diaphragm of one of the pressure sensors in proximity to one another, wherein a pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle.
    Type: Application
    Filed: October 28, 2014
    Publication date: April 28, 2016
    Inventors: BRUNO J. DEBEURRE, ALBERT S. CHECKANOV, JANSEN D. CURRENS, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
  • Publication number: 20160107887
    Abstract: A method for testing a plurality of pressure sensors on a device wafer includes placing a diaphragm of one of the pressure sensors on the device wafer in proximity to a nozzle of a test system. A pneumatic pressure stimulus is applied to the diaphragm via an outlet of the nozzle and a cavity pressure is measured within a cavity associated with the pressure sensor in response to application of the pneumatic pressure stimulus. The pneumatic pressure stimulus within the cavity corresponds to the pressure applied to the diaphragm. Methodology is executed to test the strength and/or stiffness of the diaphragm. Additionally, the methodology and test system can be utilized to determine an individual calibration factor for each pressure sensor on the device wafer.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 21, 2016
    Inventors: BRUNO J. DEBEURRE, PETER T. JONES, WILLIAM D. MCWHORTER, RAIMONDO P. SESSEGO
  • Publication number: 20150179325
    Abstract: Methods, systems and apparatus are provided to apply a magnetic pre-conditioning to magnetic tunneling junction (MTJ) sensors and other micro-magnetic devices after fabrication but before testing, trimming or other subsequent processing. The fabricated sensor device is passed through a magnetic field that has a known direction and orientation relative to the device so that the device is placed into a known state prior to final testing and trimming. Various embodiments allow the field to be applied in situ by a permanent magnet or electromagnet as the devices are being processed by a conventional device handler or similar processing system.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Inventors: CARLOS M. ACUNA, MOHAMMAD A. FARUQUE, KEVIN R. FUGATE, TODD D. HOFFMANN, PAIGE M. HOLM, PETER T. JONES, RIGOBERTO LOPEZ, JR., WILLIAM D. MCWHORTER
  • Publication number: 20140303926
    Abstract: Embodiments of systems for calibrating transducer-including devices include a board support structure, one or more motors, a motor control module, and a calibration control module. The board support structure holds a calibration board in a fixed position with respect to the board support structure. The motor(s) rotate the board support structure around one or more axes of a fixed coordinate system. The motor control module sends motor control signals to the motor(s) to cause the motor(s) to move the board support structure through a series of orientations with respect to the fixed coordinate system. The calibration control module sends, through a communication structure, signals to the transducer-including devices, which are loaded into a plurality of sockets of the calibration board. The signals cause the transducer-including devices to generate transducer data while the board support structure is in or moving toward each orientation of the series of orientations.
    Type: Application
    Filed: April 9, 2013
    Publication date: October 9, 2014
    Inventors: Raimondo P. Sessego, Peter T. Jones, Seyed K. Paransun, James D. Stanley, William D. McWhorter
  • Patent number: 7443174
    Abstract: “Electrical field (“E-field”) sensor systems that sense displacement or change in displacement of one body relative to another.” In general, the bodies 110, 112 are within an electrical field and displacement of a body causes a change in the E-field. A field sensor 290 detects this change and a processor 275 translates it to a change in position of the displaced body 110. The E-fields are generated by electrodes (or an electrode and a ground member) that generate the E-field. The systems include detectors 240 that detect changes in the E-field, such as capacitance, and transmit these to the processor 275.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: October 28, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Philip J. Sieh, William D. McWhorter, Bradley C. Stewart