Patents by Inventor William D. Oliver

William D. Oliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10396269
    Abstract: A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: August 27, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10199553
    Abstract: Described are concepts, systems, circuits and techniques related to shielded through via structures and methods for fabricating such shielded through via structures. The described shielded through via structures and techniques allow for assembly of multi-layer semiconductor structures including one or more superconducting semiconductor structures (or integrated circuits).
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: February 5, 2019
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10134972
    Abstract: A cryogenic quantum bit package with multiple qubit circuits facilitates inter-qubit signal propagation using a multi-chip module (MCM). Multiple qubits are grouped within the package into one or more qubit integrated circuits (ICs). The qubit ICs themselves are electrically coupled to each other via a structure including a superconducting MCM and superconducting interconnects. Coupling of quantum electrical signals between a qubit and other qubits, a substrate, or the MCM uses a coupler circuit, such as a Josephson junction, capacitor, inductor, or resonator.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 20, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 10121754
    Abstract: A method of fabricating an interconnect structure includes providing a semiconductor structure and performing a first spin resist and bake cycle. The first spin resist and bake cycle includes applying a first predetermined amount of a resist material over one or more portions of the semiconductor structure and baking the semiconductor structure to form a first resist layer portion of a resist layer. The method also includes performing a next spin resist and bake cycle. The next spin resist and bake cycle includes applying a next predetermined amount of the resist material and baking the semiconductor structure to form a next resist layer portion of the resist layer. The method additionally includes depositing a conductive material in an opening formed in the resist layer and forming a conductive structure from the conductive material. An interconnect structure is also provided.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 6, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20180247974
    Abstract: A superconducting integrated circuit includes at least one superconducting resonator, including a substrate, a conductive layer disposed over a surface of the substrate with the conductive layer including at least one conductive material including a substantially low stress polycrystalline Titanium Nitride (TiN) material having an internal stress less than about two hundred fifty MPa (magnitude) such that the at least one superconducting resonator and/or qubit (hereafter called “device”) is provided as a substantially high quality factor, low loss superconducting device.
    Type: Application
    Filed: July 21, 2016
    Publication date: August 30, 2018
    Inventors: William D. Oliver, Rabindra N. Das, David J. Hover, Danna Rosenberg, Xhovalin Miloshi, Vladimir Bolkhovsky, Jonilyn L. Yoder, Corey W. Stull, Mark A. Gouker
  • Publication number: 20180012932
    Abstract: A multi-layer semiconductor structure includes a first semiconductor structure and a second semiconductor structure, with at least one of the first and second semiconductor structures provided as a superconducting semiconductor structure. The multi-layer semiconductor structure also includes one or more interconnect structures. Each of the interconnect structures is disposed between the first and second semiconductor structures and coupled to respective ones of interconnect pads provided on the first and second semiconductor structures. Additionally, each of the interconnect structures includes a plurality of interconnect sections. At least one of the interconnect sections includes at least one superconducting and/or a partially superconducting material.
    Type: Application
    Filed: November 3, 2016
    Publication date: January 11, 2018
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20180013052
    Abstract: Quantum bit (qubit) circuits, coupler circuit structures and coupling techniques are described. Such circuits and techniques may be used to provide multi-qubit circuits suitable for use in multichip modules (MCMs).
    Type: Application
    Filed: November 3, 2016
    Publication date: January 11, 2018
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Publication number: 20170133336
    Abstract: A method of fabricating an interconnect structure includes providing a semiconductor structure and performing a first spin resist and bake cycle. The first spin resist and bake cycle includes applying a first predetermined amount of a resist material over one or more portions of the semiconductor structure and baking the semiconductor structure to form a first resist layer portion of a resist layer. The method also includes performing a next spin resist and bake cycle. The next spin resist and bake cycle includes applying a next predetermined amount of the resist material and baking the semiconductor structure to form a next resist layer portion of the resist layer. The method additionally includes depositing a conductive material in an opening formed in the resist layer and forming a conductive structure from the conductive material. An interconnect structure is also provided.
    Type: Application
    Filed: November 3, 2016
    Publication date: May 11, 2017
    Inventors: William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker
  • Patent number: 7912656
    Abstract: A system and method for providing amplitude spectroscopy is provided. Generally, the system contains a generator for providing a waveform for analysis of a multilevel quantum system, wherein the generator has the capability of changing amplitude of the waveform provided and driving the multilevel quantum system at a fixed frequency while sweeping amplitude. A detector is also provided for reading population in different energy states of the multilevel quantum system, wherein the detector plots an amplitude spectroscopy response of the multilevel quantum system. A memory and processor are provided within the system where the processor is configured by the memory to perform the step of plotting an energy-level diagram of the multilevel quantum system from the amplitude spectroscopy plot of the multilevel quantum system.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: March 22, 2011
    Assignee: Massachusetts Institute of Technology
    Inventors: David M. Berns, Mark S. Rudner, Sergio O. Valenzuela, William D. Oliver, Leonid S. Levitov, Terry P. Orlando
  • Publication number: 20100109638
    Abstract: A system and method for providing amplitude spectroscopy is provided. Generally, the system contains a generator for providing a waveform for analysis of a multilevel quantum system, wherein the generator has the capability of changing amplitude of the waveform provided and driving the multilevel quantum system at a fixed frequency while sweeping amplitude. A detector is also provided for reading population in different energy states of the multilevel quantum system, wherein the detector plots an amplitude spectroscopy response of the multilevel quantum system. A memory and processor are provided within the system where the processor is configured by the memory to perform the step of plotting an energy-level diagram of the multilevel quantum system from the amplitude spectroscopy plot of the multilevel quantum system.
    Type: Application
    Filed: September 3, 2009
    Publication date: May 6, 2010
    Applicant: Massachusetts Institute of Technology
    Inventors: David M. Berns, Mark S. Rudner, Sergio Valenzuela, William D. Oliver, Leonid S. Levitov, Terry P. Orlanda
  • Patent number: 7093856
    Abstract: A truck tank to be carried in the bed of a pickup truck equipped with a bed-mounted hitch. The tank is profiled to fit within the wheel wells of the truck bed and to have either an arched recess formed in the bottom to accommodate the hitch when the tank is lifted into the bed or alternatively, an arched groove extending from the arched recess to the side of the tank so as to permit the tank to be slid into the truck bed.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: August 22, 2006
    Assignees: Flexahopper Plastics Ltd.
    Inventors: J. W. (Bill) Spenceley, William D. Oliver
  • Publication number: 20040178204
    Abstract: A truck tank to be carried in the bed of a pickup truck equipped with a bed-mounted hitch. The tank is profiled to fit within the wheel wells of the truck bed and to have either an arched recess formed in the bottom to accommodate the hitch when the tank is lifted into the bed or alternatively, an arched groove extending from the arched recess to the side of the tank so as to permit the tank to be slid into the truck bed.
    Type: Application
    Filed: March 13, 2003
    Publication date: September 16, 2004
    Inventors: J. W. Spenceley, William D. Oliver